Enhanced Grain Growth of Electroplated Copper Film by Annealing in Supercritical CO2 with H2

Y. Shimada, S. Yomogida, S. Akahori, T. Yamamoto, T. Yamaguchi, Y. Aoki, A. Matsuyama, T. Yata, H. Hashimoto, K. Ueno

Research output: Contribution to journalArticle

Original languageEnglish
JournalExtended Abstracts of Advanced Metallization Conference (ADMETA) 2009
Publication statusPublished - 2009 Oct 20

Cite this

Enhanced Grain Growth of Electroplated Copper Film by Annealing in Supercritical CO2 with H2. / Shimada, Y.; Yomogida, S.; Akahori, S.; Yamamoto, T.; Yamaguchi, T.; Aoki, Y.; Matsuyama, A.; Yata, T.; Hashimoto, H.; Ueno, K.

In: Extended Abstracts of Advanced Metallization Conference (ADMETA) 2009, 20.10.2009.

Research output: Contribution to journalArticle

Shimada, Y, Yomogida, S, Akahori, S, Yamamoto, T, Yamaguchi, T, Aoki, Y, Matsuyama, A, Yata, T, Hashimoto, H & Ueno, K 2009, 'Enhanced Grain Growth of Electroplated Copper Film by Annealing in Supercritical CO2 with H2', Extended Abstracts of Advanced Metallization Conference (ADMETA) 2009.
Shimada, Y. ; Yomogida, S. ; Akahori, S. ; Yamamoto, T. ; Yamaguchi, T. ; Aoki, Y. ; Matsuyama, A. ; Yata, T. ; Hashimoto, H. ; Ueno, K. / Enhanced Grain Growth of Electroplated Copper Film by Annealing in Supercritical CO2 with H2. In: Extended Abstracts of Advanced Metallization Conference (ADMETA) 2009. 2009.
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AU - Yomogida, S.

AU - Akahori, S.

AU - Yamamoto, T.

AU - Yamaguchi, T.

AU - Aoki, Y.

AU - Matsuyama, A.

AU - Yata, T.

AU - Hashimoto, H.

AU - Ueno, K.

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