Enhanced Grain Growth of Electroplated Copper Film by Annealing in Supercritical CO2 with H2

Y. Shimada; S. Yomogida; S. Akahori; T. Yamamoto; T. Yamaguchi; Y. Aoki; A. Matsuyama; T. Yata; H. Hashimoto; K. Ueno

Enhanced Grain Growth of Electroplated Copper Film by Annealing in Supercritical CO2 with H2

Y. Shimada, S. Yomogida, S. Akahori, T. Yamamoto, T. Yamaguchi, Y. Aoki, A. Matsuyama, T. Yata, H. Hashimoto, K. Ueno

Functional Control Systems

Research output: Contribution to journal › Article › peer-review

Original language	English
Journal	Extended Abstracts of Advanced Metallization Conference (ADMETA) 2009
Publication status	Published - 2009 Oct 20

Cite this

@article{a7a505404eec4193a600540b1e4464c4,

title = "Enhanced Grain Growth of Electroplated Copper Film by Annealing in Supercritical CO2 with H2",

author = "Y. Shimada and S. Yomogida and S. Akahori and T. Yamamoto and T. Yamaguchi and Y. Aoki and A. Matsuyama and T. Yata and H. Hashimoto and K. Ueno",

year = "2009",

month = oct,

day = "20",

language = "English",

journal = "Extended Abstracts of Advanced Metallization Conference (ADMETA) 2009",

}

TY - JOUR

T1 - Enhanced Grain Growth of Electroplated Copper Film by Annealing in Supercritical CO2 with H2

AU - Shimada, Y.

AU - Yomogida, S.

AU - Akahori, S.

AU - Yamamoto, T.

AU - Yamaguchi, T.

AU - Aoki, Y.

AU - Matsuyama, A.

AU - Yata, T.

AU - Hashimoto, H.

AU - Ueno, K.

PY - 2009/10/20

Y1 - 2009/10/20

M3 - Article

JO - Extended Abstracts of Advanced Metallization Conference (ADMETA) 2009

JF - Extended Abstracts of Advanced Metallization Conference (ADMETA) 2009

ER -