Enhanced Grain Growth of Electroplated Copper Film by Annealing in Supercritical CO2 with H2

Y. Shimada, S. Yomogida, S. Akahori, T. Yamamoto, T. Yamaguchi, Y. Aoki, A. Matsuyama, T. Yata, H. Hashimoto, K. Ueno

Research output: Contribution to journalArticle

Original languageEnglish
JournalExtended Abstracts of Advanced Metallization Conference (ADMETA) 2009
Publication statusPublished - 2009 Oct 20

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