Etching method for fabricating ultracompact three-dimensional monolithic microwave integrated circuits

Suehiro Sugitani, Kiyomitsu Onodera, Shinji Aoyama, Makoto Hirano, Masami Tokumitsu

    Research output: Contribution to journalConference article

    2 Citations (Scopus)

    Abstract

    The fabrication of ultracompact three dimensional monolithic microwave circuits (MMIC) having a sophisticated three-dimensional (3D) interconnection structure was discussed. The circuits were manufactured using the inductively coupled plasma etching with a double-layer mask, consisting of WSi covered with photoresists containing silicon. The developed method enabled the formation of holes to any levels of interconnections simultaneously. It resulted in smaller chip area, higher performance and greater design flexibility in MMICs.

    Original languageEnglish
    Pages (from-to)1019-1025
    Number of pages7
    JournalJournal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
    Volume20
    Issue number3
    DOIs
    Publication statusPublished - 2002 May 1
    Event20th North American Conference on Molecular Beam Epitaxy - Providence, RI, United States
    Duration: 2001 Oct 12001 Oct 3

    ASJC Scopus subject areas

    • Condensed Matter Physics
    • Electrical and Electronic Engineering

    Fingerprint Dive into the research topics of 'Etching method for fabricating ultracompact three-dimensional monolithic microwave integrated circuits'. Together they form a unique fingerprint.

  • Cite this