Evaluation of Adhesive Fracture Energy of Polyimide Interlayer Dielectric Film for Redistribution Layer of Semiconductor Package

Kenta Ono, Yoshiharu Kariya

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The adhesive fracture energy \mathcal{G}-{c} of the polyimide film (PI) on the copper film was evaluated by the peel test. By obtaining \mathcal{G} in the actual redistribution layer structure by FEM analysis, the peel strength of PI on the copper circuit in the structure was evaluated by the master curve of \mathcal{G}-{c} established from the peel test result.

Original languageEnglish
Title of host publicationProceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019
PublisherInstitute of Electrical and Electronics Engineers Inc.
Number of pages1
ISBN (Electronic)9784904743072
DOIs
Publication statusPublished - 2019 May 1
Event6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019 - Kanazawa, Ishikawa, Japan
Duration: 2019 May 212019 May 25

Publication series

NameProceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019

Conference

Conference6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019
CountryJapan
CityKanazawa, Ishikawa
Period19/5/2119/5/25

Fingerprint

Dielectric films
Fracture energy
Polyimides
Semiconductor materials
Copper
Adhesives
Finite element method
Networks (circuits)

ASJC Scopus subject areas

  • Process Chemistry and Technology
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Ono, K., & Kariya, Y. (2019). Evaluation of Adhesive Fracture Energy of Polyimide Interlayer Dielectric Film for Redistribution Layer of Semiconductor Package. In Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019 [8735249] (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.23919/LTB-3D.2019.8735249

Evaluation of Adhesive Fracture Energy of Polyimide Interlayer Dielectric Film for Redistribution Layer of Semiconductor Package. / Ono, Kenta; Kariya, Yoshiharu.

Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 2019. 8735249 (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Ono, K & Kariya, Y 2019, Evaluation of Adhesive Fracture Energy of Polyimide Interlayer Dielectric Film for Redistribution Layer of Semiconductor Package. in Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019., 8735249, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019, Institute of Electrical and Electronics Engineers Inc., 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019, Kanazawa, Ishikawa, Japan, 19/5/21. https://doi.org/10.23919/LTB-3D.2019.8735249
Ono K, Kariya Y. Evaluation of Adhesive Fracture Energy of Polyimide Interlayer Dielectric Film for Redistribution Layer of Semiconductor Package. In Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc. 2019. 8735249. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019). https://doi.org/10.23919/LTB-3D.2019.8735249
Ono, Kenta ; Kariya, Yoshiharu. / Evaluation of Adhesive Fracture Energy of Polyimide Interlayer Dielectric Film for Redistribution Layer of Semiconductor Package. Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 2019. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).
@inproceedings{be4d17fbb7b1457e83b9e68f41674f53,
title = "Evaluation of Adhesive Fracture Energy of Polyimide Interlayer Dielectric Film for Redistribution Layer of Semiconductor Package",
abstract = "The adhesive fracture energy \mathcal{G}-{c} of the polyimide film (PI) on the copper film was evaluated by the peel test. By obtaining \mathcal{G} in the actual redistribution layer structure by FEM analysis, the peel strength of PI on the copper circuit in the structure was evaluated by the master curve of \mathcal{G}-{c} established from the peel test result.",
author = "Kenta Ono and Yoshiharu Kariya",
year = "2019",
month = "5",
day = "1",
doi = "10.23919/LTB-3D.2019.8735249",
language = "English",
series = "Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019",

}

TY - GEN

T1 - Evaluation of Adhesive Fracture Energy of Polyimide Interlayer Dielectric Film for Redistribution Layer of Semiconductor Package

AU - Ono, Kenta

AU - Kariya, Yoshiharu

PY - 2019/5/1

Y1 - 2019/5/1

N2 - The adhesive fracture energy \mathcal{G}-{c} of the polyimide film (PI) on the copper film was evaluated by the peel test. By obtaining \mathcal{G} in the actual redistribution layer structure by FEM analysis, the peel strength of PI on the copper circuit in the structure was evaluated by the master curve of \mathcal{G}-{c} established from the peel test result.

AB - The adhesive fracture energy \mathcal{G}-{c} of the polyimide film (PI) on the copper film was evaluated by the peel test. By obtaining \mathcal{G} in the actual redistribution layer structure by FEM analysis, the peel strength of PI on the copper circuit in the structure was evaluated by the master curve of \mathcal{G}-{c} established from the peel test result.

UR - http://www.scopus.com/inward/record.url?scp=85068374052&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85068374052&partnerID=8YFLogxK

U2 - 10.23919/LTB-3D.2019.8735249

DO - 10.23919/LTB-3D.2019.8735249

M3 - Conference contribution

AN - SCOPUS:85068374052

T3 - Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019

BT - Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019

PB - Institute of Electrical and Electronics Engineers Inc.

ER -