Evaluation of creep properties for Sn-Ag-Cu micro solder joint by multi-temperature stress relaxation test

Yoshihiko Kanda, Yoshiharu Kariya

Research output: Contribution to journalArticle

19 Citations (Scopus)

Abstract

The creep properties of a Sn-Ag-Cu micro solder joint with a solder ball with 500 μm were investigated by a multi-temperature stress relaxation test performed using a specimen at three temperatures (298, 348, and 398 K). The stress exponents in Norton's law were 8 at 398 K, 8.8 at 348 K, and 9 at 298 K, and the activation energies were found to be 39 kJ/mol in the high-stress region and 80 kJ/mol in the low-stress region. The stress exponent in Norton's law for a micro solder joint was lower than that for a large-scale specimen, which resulted in more coarsened intermetallics in the microstructure than in the large-scale specimen. The activation energies for the micro solder joint were almost equal to those for the large-scale specimen in the high- and low-stress regions. These results reflect the microstructure of the micro solder joint, and the creep constitutive equation for the Sn-Ag-Cu joint could be derived by the multi-temperature stress relaxation test proposed in this study.

Original languageEnglish
Pages (from-to)1435-1440
Number of pages6
JournalMicroelectronics Reliability
Volume52
Issue number7
DOIs
Publication statusPublished - 2012 Jul 1

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Safety, Risk, Reliability and Quality
  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering

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