Evaluation of creep properties for Sn-Ag-Cu micro solder joint by multi-temperature stress relaxation test

Yoshihiko Kanda, Yoshiharu Kariya

Research output: Contribution to journalArticle

18 Citations (Scopus)

Abstract

The creep properties of a Sn-Ag-Cu micro solder joint with a solder ball with 500 μm were investigated by a multi-temperature stress relaxation test performed using a specimen at three temperatures (298, 348, and 398 K). The stress exponents in Norton's law were 8 at 398 K, 8.8 at 348 K, and 9 at 298 K, and the activation energies were found to be 39 kJ/mol in the high-stress region and 80 kJ/mol in the low-stress region. The stress exponent in Norton's law for a micro solder joint was lower than that for a large-scale specimen, which resulted in more coarsened intermetallics in the microstructure than in the large-scale specimen. The activation energies for the micro solder joint were almost equal to those for the large-scale specimen in the high- and low-stress regions. These results reflect the microstructure of the micro solder joint, and the creep constitutive equation for the Sn-Ag-Cu joint could be derived by the multi-temperature stress relaxation test proposed in this study.

Original languageEnglish
Pages (from-to)1435-1440
Number of pages6
JournalMicroelectronics Reliability
Volume52
Issue number7
DOIs
Publication statusPublished - 2012 Jul

Fingerprint

creep properties
stress relaxation
Stress relaxation
solders
Soldering alloys
Creep
evaluation
Temperature
temperature
Activation energy
exponents
activation energy
microstructure
Microstructure
constitutive equations
Constitutive equations
Intermetallics
intermetallics
balls

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Surfaces, Coatings and Films
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Safety, Risk, Reliability and Quality

Cite this

Evaluation of creep properties for Sn-Ag-Cu micro solder joint by multi-temperature stress relaxation test. / Kanda, Yoshihiko; Kariya, Yoshiharu.

In: Microelectronics Reliability, Vol. 52, No. 7, 07.2012, p. 1435-1440.

Research output: Contribution to journalArticle

@article{a0b754460578461e9d7ea2c901e7618f,
title = "Evaluation of creep properties for Sn-Ag-Cu micro solder joint by multi-temperature stress relaxation test",
abstract = "The creep properties of a Sn-Ag-Cu micro solder joint with a solder ball with 500 μm were investigated by a multi-temperature stress relaxation test performed using a specimen at three temperatures (298, 348, and 398 K). The stress exponents in Norton's law were 8 at 398 K, 8.8 at 348 K, and 9 at 298 K, and the activation energies were found to be 39 kJ/mol in the high-stress region and 80 kJ/mol in the low-stress region. The stress exponent in Norton's law for a micro solder joint was lower than that for a large-scale specimen, which resulted in more coarsened intermetallics in the microstructure than in the large-scale specimen. The activation energies for the micro solder joint were almost equal to those for the large-scale specimen in the high- and low-stress regions. These results reflect the microstructure of the micro solder joint, and the creep constitutive equation for the Sn-Ag-Cu joint could be derived by the multi-temperature stress relaxation test proposed in this study.",
author = "Yoshihiko Kanda and Yoshiharu Kariya",
year = "2012",
month = "7",
doi = "10.1016/j.microrel.2012.02.006",
language = "English",
volume = "52",
pages = "1435--1440",
journal = "Microelectronics and Reliability",
issn = "0026-2714",
publisher = "Elsevier Limited",
number = "7",

}

TY - JOUR

T1 - Evaluation of creep properties for Sn-Ag-Cu micro solder joint by multi-temperature stress relaxation test

AU - Kanda, Yoshihiko

AU - Kariya, Yoshiharu

PY - 2012/7

Y1 - 2012/7

N2 - The creep properties of a Sn-Ag-Cu micro solder joint with a solder ball with 500 μm were investigated by a multi-temperature stress relaxation test performed using a specimen at three temperatures (298, 348, and 398 K). The stress exponents in Norton's law were 8 at 398 K, 8.8 at 348 K, and 9 at 298 K, and the activation energies were found to be 39 kJ/mol in the high-stress region and 80 kJ/mol in the low-stress region. The stress exponent in Norton's law for a micro solder joint was lower than that for a large-scale specimen, which resulted in more coarsened intermetallics in the microstructure than in the large-scale specimen. The activation energies for the micro solder joint were almost equal to those for the large-scale specimen in the high- and low-stress regions. These results reflect the microstructure of the micro solder joint, and the creep constitutive equation for the Sn-Ag-Cu joint could be derived by the multi-temperature stress relaxation test proposed in this study.

AB - The creep properties of a Sn-Ag-Cu micro solder joint with a solder ball with 500 μm were investigated by a multi-temperature stress relaxation test performed using a specimen at three temperatures (298, 348, and 398 K). The stress exponents in Norton's law were 8 at 398 K, 8.8 at 348 K, and 9 at 298 K, and the activation energies were found to be 39 kJ/mol in the high-stress region and 80 kJ/mol in the low-stress region. The stress exponent in Norton's law for a micro solder joint was lower than that for a large-scale specimen, which resulted in more coarsened intermetallics in the microstructure than in the large-scale specimen. The activation energies for the micro solder joint were almost equal to those for the large-scale specimen in the high- and low-stress regions. These results reflect the microstructure of the micro solder joint, and the creep constitutive equation for the Sn-Ag-Cu joint could be derived by the multi-temperature stress relaxation test proposed in this study.

UR - http://www.scopus.com/inward/record.url?scp=84861830309&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84861830309&partnerID=8YFLogxK

U2 - 10.1016/j.microrel.2012.02.006

DO - 10.1016/j.microrel.2012.02.006

M3 - Article

VL - 52

SP - 1435

EP - 1440

JO - Microelectronics and Reliability

JF - Microelectronics and Reliability

SN - 0026-2714

IS - 7

ER -