Evaluation of grinding performance by mechanical properties of super abrasive wheel - Relationship between modulus of rupture and critical grain holding power (2nd report)

Takekazu Sawa, Naohiro Nishikawa, Yasushi Ikuse

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

This study was examined about the relationship between the fillers added to the grain layer of a resinoid bond diamond wheel and mechanical properties, the grade, the grinding performance. In the abrasion test using a constant pressure grinding, it was shown clearly that the critical grain holding power changed by kinds of fillers. On the other hand, in the constant cut surface grinding, the grinding interval was evaluated based on the grinding force. And, it was confirmed that the grinding interval changed by kinds of filler. Also, it was found that the characteristics of truing and dressing changed by kinds of filler. In addition, Young's modulus and bending strength of the grain layer of a resinoid bond diamond wheel was measured by three point bending test and ultrasonic pulse method. In the results, it checked that the mechanical properties such as bending strength and Young's modulus of a grain layer changed by kinds of filler. And, the modulus of rupture was calculated from the Young's modulus and bending strength.

The result of having compared the modulus of rupture with the critical grain holding power, it was found that the modulus of rupture and the critical grain holding power have good correlation. Namely, the critical grain holding power of a resinoid bond diamond wheel can be evaluated by the modulus of rupture. Furthermore, it was shown that the grinding performance may be able to be predicted by the modulus of rupture of a grain layer of a resinoid bond diamond wheel.

Original languageEnglish
Title of host publicationAdvanced Materials Research
PublisherTrans Tech Publications Ltd
Pages267-272
Number of pages6
Volume1017
ISBN (Print)9783038352211
DOIs
Publication statusPublished - 2014
Event17th International Symposium on Advances in Abrasive Technology, ISAAT 2014 - Kailua
Duration: 2014 Sep 222014 Sep 25

Publication series

NameAdvanced Materials Research
Volume1017
ISSN (Print)10226680
ISSN (Electronic)16628985

Other

Other17th International Symposium on Advances in Abrasive Technology, ISAAT 2014
CityKailua
Period14/9/2214/9/25

Fingerprint

Grinding wheels
Fillers
Diamonds
Wheels
Mechanical properties
Bending strength
Elastic moduli
Bending tests
Abrasion
Ultrasonics

Keywords

  • Bending strength
  • Diamond wheel
  • Elastic modulus
  • Grain holding power
  • Grinding performance
  • Modulus of rupture
  • Resinoidoid bond

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Sawa, T., Nishikawa, N., & Ikuse, Y. (2014). Evaluation of grinding performance by mechanical properties of super abrasive wheel - Relationship between modulus of rupture and critical grain holding power (2nd report). In Advanced Materials Research (Vol. 1017, pp. 267-272). (Advanced Materials Research; Vol. 1017). Trans Tech Publications Ltd. https://doi.org/10.4028/www.scientific.net/AMR.1017.267

Evaluation of grinding performance by mechanical properties of super abrasive wheel - Relationship between modulus of rupture and critical grain holding power (2nd report). / Sawa, Takekazu; Nishikawa, Naohiro; Ikuse, Yasushi.

Advanced Materials Research. Vol. 1017 Trans Tech Publications Ltd, 2014. p. 267-272 (Advanced Materials Research; Vol. 1017).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Sawa, T, Nishikawa, N & Ikuse, Y 2014, Evaluation of grinding performance by mechanical properties of super abrasive wheel - Relationship between modulus of rupture and critical grain holding power (2nd report). in Advanced Materials Research. vol. 1017, Advanced Materials Research, vol. 1017, Trans Tech Publications Ltd, pp. 267-272, 17th International Symposium on Advances in Abrasive Technology, ISAAT 2014, Kailua, 14/9/22. https://doi.org/10.4028/www.scientific.net/AMR.1017.267
Sawa, Takekazu ; Nishikawa, Naohiro ; Ikuse, Yasushi. / Evaluation of grinding performance by mechanical properties of super abrasive wheel - Relationship between modulus of rupture and critical grain holding power (2nd report). Advanced Materials Research. Vol. 1017 Trans Tech Publications Ltd, 2014. pp. 267-272 (Advanced Materials Research).
@inproceedings{988197dff55c4b4f89194df444695a6b,
title = "Evaluation of grinding performance by mechanical properties of super abrasive wheel - Relationship between modulus of rupture and critical grain holding power (2nd report)",
abstract = "This study was examined about the relationship between the fillers added to the grain layer of a resinoid bond diamond wheel and mechanical properties, the grade, the grinding performance. In the abrasion test using a constant pressure grinding, it was shown clearly that the critical grain holding power changed by kinds of fillers. On the other hand, in the constant cut surface grinding, the grinding interval was evaluated based on the grinding force. And, it was confirmed that the grinding interval changed by kinds of filler. Also, it was found that the characteristics of truing and dressing changed by kinds of filler. In addition, Young's modulus and bending strength of the grain layer of a resinoid bond diamond wheel was measured by three point bending test and ultrasonic pulse method. In the results, it checked that the mechanical properties such as bending strength and Young's modulus of a grain layer changed by kinds of filler. And, the modulus of rupture was calculated from the Young's modulus and bending strength.The result of having compared the modulus of rupture with the critical grain holding power, it was found that the modulus of rupture and the critical grain holding power have good correlation. Namely, the critical grain holding power of a resinoid bond diamond wheel can be evaluated by the modulus of rupture. Furthermore, it was shown that the grinding performance may be able to be predicted by the modulus of rupture of a grain layer of a resinoid bond diamond wheel.",
keywords = "Bending strength, Diamond wheel, Elastic modulus, Grain holding power, Grinding performance, Modulus of rupture, Resinoidoid bond",
author = "Takekazu Sawa and Naohiro Nishikawa and Yasushi Ikuse",
year = "2014",
doi = "10.4028/www.scientific.net/AMR.1017.267",
language = "English",
isbn = "9783038352211",
volume = "1017",
series = "Advanced Materials Research",
publisher = "Trans Tech Publications Ltd",
pages = "267--272",
booktitle = "Advanced Materials Research",

}

TY - GEN

T1 - Evaluation of grinding performance by mechanical properties of super abrasive wheel - Relationship between modulus of rupture and critical grain holding power (2nd report)

AU - Sawa, Takekazu

AU - Nishikawa, Naohiro

AU - Ikuse, Yasushi

PY - 2014

Y1 - 2014

N2 - This study was examined about the relationship between the fillers added to the grain layer of a resinoid bond diamond wheel and mechanical properties, the grade, the grinding performance. In the abrasion test using a constant pressure grinding, it was shown clearly that the critical grain holding power changed by kinds of fillers. On the other hand, in the constant cut surface grinding, the grinding interval was evaluated based on the grinding force. And, it was confirmed that the grinding interval changed by kinds of filler. Also, it was found that the characteristics of truing and dressing changed by kinds of filler. In addition, Young's modulus and bending strength of the grain layer of a resinoid bond diamond wheel was measured by three point bending test and ultrasonic pulse method. In the results, it checked that the mechanical properties such as bending strength and Young's modulus of a grain layer changed by kinds of filler. And, the modulus of rupture was calculated from the Young's modulus and bending strength.The result of having compared the modulus of rupture with the critical grain holding power, it was found that the modulus of rupture and the critical grain holding power have good correlation. Namely, the critical grain holding power of a resinoid bond diamond wheel can be evaluated by the modulus of rupture. Furthermore, it was shown that the grinding performance may be able to be predicted by the modulus of rupture of a grain layer of a resinoid bond diamond wheel.

AB - This study was examined about the relationship between the fillers added to the grain layer of a resinoid bond diamond wheel and mechanical properties, the grade, the grinding performance. In the abrasion test using a constant pressure grinding, it was shown clearly that the critical grain holding power changed by kinds of fillers. On the other hand, in the constant cut surface grinding, the grinding interval was evaluated based on the grinding force. And, it was confirmed that the grinding interval changed by kinds of filler. Also, it was found that the characteristics of truing and dressing changed by kinds of filler. In addition, Young's modulus and bending strength of the grain layer of a resinoid bond diamond wheel was measured by three point bending test and ultrasonic pulse method. In the results, it checked that the mechanical properties such as bending strength and Young's modulus of a grain layer changed by kinds of filler. And, the modulus of rupture was calculated from the Young's modulus and bending strength.The result of having compared the modulus of rupture with the critical grain holding power, it was found that the modulus of rupture and the critical grain holding power have good correlation. Namely, the critical grain holding power of a resinoid bond diamond wheel can be evaluated by the modulus of rupture. Furthermore, it was shown that the grinding performance may be able to be predicted by the modulus of rupture of a grain layer of a resinoid bond diamond wheel.

KW - Bending strength

KW - Diamond wheel

KW - Elastic modulus

KW - Grain holding power

KW - Grinding performance

KW - Modulus of rupture

KW - Resinoidoid bond

UR - http://www.scopus.com/inward/record.url?scp=84913588570&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84913588570&partnerID=8YFLogxK

U2 - 10.4028/www.scientific.net/AMR.1017.267

DO - 10.4028/www.scientific.net/AMR.1017.267

M3 - Conference contribution

AN - SCOPUS:84913588570

SN - 9783038352211

VL - 1017

T3 - Advanced Materials Research

SP - 267

EP - 272

BT - Advanced Materials Research

PB - Trans Tech Publications Ltd

ER -