Evaluation of grinding performance by mechanical properties of super abrasive wheel - Relationship between modulus of rupture and critical grain holding power (2nd report)

Takekazu Sawa, Naohiro Nishikawa, Yasushi Ikuse

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

This study was examined about the relationship between the fillers added to the grain layer of a resinoid bond diamond wheel and mechanical properties, the grade, the grinding performance. In the abrasion test using a constant pressure grinding, it was shown clearly that the critical grain holding power changed by kinds of fillers. On the other hand, in the constant cut surface grinding, the grinding interval was evaluated based on the grinding force. And, it was confirmed that the grinding interval changed by kinds of filler. Also, it was found that the characteristics of truing and dressing changed by kinds of filler. In addition, Young's modulus and bending strength of the grain layer of a resinoid bond diamond wheel was measured by three point bending test and ultrasonic pulse method. In the results, it checked that the mechanical properties such as bending strength and Young's modulus of a grain layer changed by kinds of filler. And, the modulus of rupture was calculated from the Young's modulus and bending strength.

The result of having compared the modulus of rupture with the critical grain holding power, it was found that the modulus of rupture and the critical grain holding power have good correlation. Namely, the critical grain holding power of a resinoid bond diamond wheel can be evaluated by the modulus of rupture. Furthermore, it was shown that the grinding performance may be able to be predicted by the modulus of rupture of a grain layer of a resinoid bond diamond wheel.

Original languageEnglish
Title of host publicationAdvances in Abrasive Technology XVII
EditorsJiwang Yan, Hideki Aoyama, Akinori Yui
PublisherTrans Tech Publications Ltd
Pages267-272
Number of pages6
ISBN (Electronic)9783038352211
DOIs
Publication statusPublished - 2014 Jan 1
Event17th International Symposium on Advances in Abrasive Technology, ISAAT 2014 - Kailua, United States
Duration: 2014 Sep 222014 Sep 25

Publication series

NameAdvanced Materials Research
Volume1017
ISSN (Print)1022-6680
ISSN (Electronic)1662-8985

Conference

Conference17th International Symposium on Advances in Abrasive Technology, ISAAT 2014
CountryUnited States
CityKailua
Period14/9/2214/9/25

Keywords

  • Bending strength
  • Diamond wheel
  • Elastic modulus
  • Grain holding power
  • Grinding performance
  • Modulus of rupture
  • Resinoidoid bond

ASJC Scopus subject areas

  • Engineering(all)

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  • Cite this

    Sawa, T., Nishikawa, N., & Ikuse, Y. (2014). Evaluation of grinding performance by mechanical properties of super abrasive wheel - Relationship between modulus of rupture and critical grain holding power (2nd report). In J. Yan, H. Aoyama, & A. Yui (Eds.), Advances in Abrasive Technology XVII (pp. 267-272). (Advanced Materials Research; Vol. 1017). Trans Tech Publications Ltd. https://doi.org/10.4028/www.scientific.net/AMR.1017.267