Evaluation of the grinding performance by mechanical properties of super abrasive wheel - Relationship between modulus of rupture and the critical grain holding power

Takekazu Sawa, Yasushi Ikuse, Naohiro Nishikawa, Tosimi Odaki, Susumu Tomita, Tomohiro Yokota, Masahiro Yokouchi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

This paper describes relationship between the grade and mechanical properties of a diamond wheel. The grade of a diamond wheel was investigated by abrasion test using diamond sticks of the same composition as a grain layer. The critical pressure and abrasion rate of diamond sticks were measured from abrasion test. Further, the number of grains on a unit area was calculated by approximating an abrasive grain to a sphere and a cube, and critical grain holding power was calculated by dividing the critical pressure by the number of grains on a unit area. The mechanical properties of a diamond stick measured bending strength and elastic modulus. Bending strength was measured by a three point bending test, and the elastic modulus was measured by an ultrasonic pulse method. In addition, Modulus of rupture was calculated from bending strength and elastic modulus. The relationship between the grade and mechanical properties of a diamond stick was considered by comparing the critical grain holding power with modulus of rupture. As the results, it found that the critical grain holding power and modulus of rupture of a diamond stick showed good correlation.

Original languageEnglish
Title of host publication10th International Conference on Progress of Machining Technology, ICPMT 2012
Pages27-30
Number of pages4
Publication statusPublished - 2012
Externally publishedYes
Event10th International Conference on Progress of Machining Technology, ICPMT 2012 - Tsubame, Niigata
Duration: 2012 Sep 252012 Sep 27

Other

Other10th International Conference on Progress of Machining Technology, ICPMT 2012
CityTsubame, Niigata
Period12/9/2512/9/27

Fingerprint

Grinding wheels
Diamonds
Mechanical properties
Abrasion
Bending strength
Elastic moduli
Wheels
Bending tests
Abrasives
Ultrasonics
Chemical analysis

Keywords

  • Bending strength
  • Diamond wheel
  • Elastic modulus
  • Grain holding power
  • Grinding performance
  • Modulus of rupture

ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering

Cite this

Sawa, T., Ikuse, Y., Nishikawa, N., Odaki, T., Tomita, S., Yokota, T., & Yokouchi, M. (2012). Evaluation of the grinding performance by mechanical properties of super abrasive wheel - Relationship between modulus of rupture and the critical grain holding power. In 10th International Conference on Progress of Machining Technology, ICPMT 2012 (pp. 27-30)

Evaluation of the grinding performance by mechanical properties of super abrasive wheel - Relationship between modulus of rupture and the critical grain holding power. / Sawa, Takekazu; Ikuse, Yasushi; Nishikawa, Naohiro; Odaki, Tosimi; Tomita, Susumu; Yokota, Tomohiro; Yokouchi, Masahiro.

10th International Conference on Progress of Machining Technology, ICPMT 2012. 2012. p. 27-30.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Sawa, T, Ikuse, Y, Nishikawa, N, Odaki, T, Tomita, S, Yokota, T & Yokouchi, M 2012, Evaluation of the grinding performance by mechanical properties of super abrasive wheel - Relationship between modulus of rupture and the critical grain holding power. in 10th International Conference on Progress of Machining Technology, ICPMT 2012. pp. 27-30, 10th International Conference on Progress of Machining Technology, ICPMT 2012, Tsubame, Niigata, 12/9/25.
Sawa T, Ikuse Y, Nishikawa N, Odaki T, Tomita S, Yokota T et al. Evaluation of the grinding performance by mechanical properties of super abrasive wheel - Relationship between modulus of rupture and the critical grain holding power. In 10th International Conference on Progress of Machining Technology, ICPMT 2012. 2012. p. 27-30
Sawa, Takekazu ; Ikuse, Yasushi ; Nishikawa, Naohiro ; Odaki, Tosimi ; Tomita, Susumu ; Yokota, Tomohiro ; Yokouchi, Masahiro. / Evaluation of the grinding performance by mechanical properties of super abrasive wheel - Relationship between modulus of rupture and the critical grain holding power. 10th International Conference on Progress of Machining Technology, ICPMT 2012. 2012. pp. 27-30
@inproceedings{7794402f857e4eb5959d08cad6ff170a,
title = "Evaluation of the grinding performance by mechanical properties of super abrasive wheel - Relationship between modulus of rupture and the critical grain holding power",
abstract = "This paper describes relationship between the grade and mechanical properties of a diamond wheel. The grade of a diamond wheel was investigated by abrasion test using diamond sticks of the same composition as a grain layer. The critical pressure and abrasion rate of diamond sticks were measured from abrasion test. Further, the number of grains on a unit area was calculated by approximating an abrasive grain to a sphere and a cube, and critical grain holding power was calculated by dividing the critical pressure by the number of grains on a unit area. The mechanical properties of a diamond stick measured bending strength and elastic modulus. Bending strength was measured by a three point bending test, and the elastic modulus was measured by an ultrasonic pulse method. In addition, Modulus of rupture was calculated from bending strength and elastic modulus. The relationship between the grade and mechanical properties of a diamond stick was considered by comparing the critical grain holding power with modulus of rupture. As the results, it found that the critical grain holding power and modulus of rupture of a diamond stick showed good correlation.",
keywords = "Bending strength, Diamond wheel, Elastic modulus, Grain holding power, Grinding performance, Modulus of rupture",
author = "Takekazu Sawa and Yasushi Ikuse and Naohiro Nishikawa and Tosimi Odaki and Susumu Tomita and Tomohiro Yokota and Masahiro Yokouchi",
year = "2012",
language = "English",
isbn = "9781629930565",
pages = "27--30",
booktitle = "10th International Conference on Progress of Machining Technology, ICPMT 2012",

}

TY - GEN

T1 - Evaluation of the grinding performance by mechanical properties of super abrasive wheel - Relationship between modulus of rupture and the critical grain holding power

AU - Sawa, Takekazu

AU - Ikuse, Yasushi

AU - Nishikawa, Naohiro

AU - Odaki, Tosimi

AU - Tomita, Susumu

AU - Yokota, Tomohiro

AU - Yokouchi, Masahiro

PY - 2012

Y1 - 2012

N2 - This paper describes relationship between the grade and mechanical properties of a diamond wheel. The grade of a diamond wheel was investigated by abrasion test using diamond sticks of the same composition as a grain layer. The critical pressure and abrasion rate of diamond sticks were measured from abrasion test. Further, the number of grains on a unit area was calculated by approximating an abrasive grain to a sphere and a cube, and critical grain holding power was calculated by dividing the critical pressure by the number of grains on a unit area. The mechanical properties of a diamond stick measured bending strength and elastic modulus. Bending strength was measured by a three point bending test, and the elastic modulus was measured by an ultrasonic pulse method. In addition, Modulus of rupture was calculated from bending strength and elastic modulus. The relationship between the grade and mechanical properties of a diamond stick was considered by comparing the critical grain holding power with modulus of rupture. As the results, it found that the critical grain holding power and modulus of rupture of a diamond stick showed good correlation.

AB - This paper describes relationship between the grade and mechanical properties of a diamond wheel. The grade of a diamond wheel was investigated by abrasion test using diamond sticks of the same composition as a grain layer. The critical pressure and abrasion rate of diamond sticks were measured from abrasion test. Further, the number of grains on a unit area was calculated by approximating an abrasive grain to a sphere and a cube, and critical grain holding power was calculated by dividing the critical pressure by the number of grains on a unit area. The mechanical properties of a diamond stick measured bending strength and elastic modulus. Bending strength was measured by a three point bending test, and the elastic modulus was measured by an ultrasonic pulse method. In addition, Modulus of rupture was calculated from bending strength and elastic modulus. The relationship between the grade and mechanical properties of a diamond stick was considered by comparing the critical grain holding power with modulus of rupture. As the results, it found that the critical grain holding power and modulus of rupture of a diamond stick showed good correlation.

KW - Bending strength

KW - Diamond wheel

KW - Elastic modulus

KW - Grain holding power

KW - Grinding performance

KW - Modulus of rupture

UR - http://www.scopus.com/inward/record.url?scp=84888179038&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84888179038&partnerID=8YFLogxK

M3 - Conference contribution

SN - 9781629930565

SP - 27

EP - 30

BT - 10th International Conference on Progress of Machining Technology, ICPMT 2012

ER -