Experiment and simulation of power supply switching current dependency on on-chip capacitance

Kozo Hoshino, Ryuki Satomi, Toshio Sudo, Hirokazu Okano, Miyuki Ishikawa, Hiroyuki Shibayama, Hiroshi Aoyagi, Hidefumi Kushibe, Kunihiko Yamagishi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

7 Citations (Scopus)

Abstract

Power distribution network (PDN) of LSI has become one of important design parameters to reduce simultaneous switching noise for core circuits as well as I/O circuits. Power distribution network of LSI generally consists of meshed power and ground conductors and on-chip decoupling capacitors. For mobile communication and automotive applications, switching current of high-performance CMOS LSIs must be controlled to be low as possible in order to suppress associated electromagnetic interference (EMI). Therefore, on-chip decoupling capacitors must be properly arranged on a chip to optimize the amount of capacitor and to minimize the occupied area by on-chip capacitor. In this paper, a CMOS test chip has been developed which has several test element groups (TEGs) inside. MOS capacitor cells were distributed in each TEG in a different density. Then, an evaluation board was designed to measure the power supply switching current for the each TEG. Furthermore, the power supply switching current was simulated by using a commercial available EDA tool. Reduction level of the switching current was measured and simulated as a function of the value of on-chip decoupling capacitor. Based on both experimental and simulation results, it has been probed that proper density of decoupling capacitor on a chip has been well estimated.

Original languageEnglish
Title of host publication2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009
DOIs
Publication statusPublished - 2009
Event2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009 - Shatin, Hong Kong, China
Duration: 2009 Dec 22009 Dec 4

Publication series

Name2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009

Conference

Conference2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009
Country/TerritoryChina
CityShatin, Hong Kong
Period09/12/209/12/4

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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