Experiment and simulation of power supply switching current dependency on on-chip capacitance

Kozo Hoshino, Ryuki Satomi, Toshio Sudo, Hirokazu Okano, Miyuki Ishikawa, Hiroyuki Shibayama, Hiroshi Aoyagi, Hidefumi Kushibe, Kunihiko Yamagishi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

7 Citations (Scopus)

Abstract

Power distribution network (PDN) of LSI has become one of important design parameters to reduce simultaneous switching noise for core circuits as well as I/O circuits. Power distribution network of LSI generally consists of meshed power and ground conductors and on-chip decoupling capacitors. For mobile communication and automotive applications, switching current of high-performance CMOS LSIs must be controlled to be low as possible in order to suppress associated electromagnetic interference (EMI). Therefore, on-chip decoupling capacitors must be properly arranged on a chip to optimize the amount of capacitor and to minimize the occupied area by on-chip capacitor. In this paper, a CMOS test chip has been developed which has several test element groups (TEGs) inside. MOS capacitor cells were distributed in each TEG in a different density. Then, an evaluation board was designed to measure the power supply switching current for the each TEG. Furthermore, the power supply switching current was simulated by using a commercial available EDA tool. Reduction level of the switching current was measured and simulated as a function of the value of on-chip decoupling capacitor. Based on both experimental and simulation results, it has been probed that proper density of decoupling capacitor on a chip has been well estimated.

Original languageEnglish
Title of host publication2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009
DOIs
Publication statusPublished - 2009
Event2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009 - Shatin, Hong Kong, China
Duration: 2009 Dec 22009 Dec 4

Publication series

Name2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009

Conference

Conference2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009
CountryChina
CityShatin, Hong Kong
Period09/12/209/12/4

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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    Hoshino, K., Satomi, R., Sudo, T., Okano, H., Ishikawa, M., Shibayama, H., Aoyagi, H., Kushibe, H., & Yamagishi, K. (2009). Experiment and simulation of power supply switching current dependency on on-chip capacitance. In 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009 [5403989] (2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009). https://doi.org/10.1109/EDAPS.2009.5403989