Experiment on evaporation heat transfer performance of porous surface

Shigeki Hirasawa, Takuya Nakajima, Tetsuya Urimoto, Yuya Tsujimoto, Yusuke Takeuchi, Tsuyoshi Kawanami, Katsuaki Shirai

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Enhancement of evaporation heat transfer performance is important for cooling of electronic devices. Evaporation heat transfer coefficient of two types of porous surfaces supplied with water liquid film was studied experimentally. First porous surface was multi layers of meshed plates with micro-channel of 0.3 mm width. Thin water liquid film was supplied to the porous surface by bubbles. Evaporation heat transfer coefficient of the porous surface with one or two layers of meshed plates was 8×104 W/m2K and it was higher than pool boiling heat transfer coefficient. Second porous surface was 1 mm thickness of glass-beads of 0.4 mm in diameter on a heated cupper plate. Water was supplied to the porous layer at the center of the plate. Evaporation heat transfer coefficient was 1000 W/m2K after water was supplied. Evaporation heat transfer coefficient increased to 7000 W/m2K before appearance of dry portion on the plate, because water film thickness in the porous layer was thin.

Original languageEnglish
Title of host publicationProceedings of the 15th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1-5
Number of pages5
ISBN (Electronic)9781467381215
DOIs
Publication statusPublished - 2016 Jul 20
Externally publishedYes
Event15th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2016 - Las Vegas, United States
Duration: 2016 May 312016 Jun 3

Other

Other15th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2016
CountryUnited States
CityLas Vegas
Period16/5/3116/6/3

Fingerprint

Heat transfer coefficients
Evaporation
Heat transfer
Water
Liquid films
Experiments
Boiling liquids
Film thickness
Cooling
Glass

Keywords

  • Cooling electronic devices
  • cross-grooved surface
  • dry portion
  • evaporation
  • heat transfer coefficient
  • pool boiling
  • porous surface
  • thin glass-beads layer

ASJC Scopus subject areas

  • Fluid Flow and Transfer Processes
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Hardware and Architecture
  • Mechanics of Materials

Cite this

Hirasawa, S., Nakajima, T., Urimoto, T., Tsujimoto, Y., Takeuchi, Y., Kawanami, T., & Shirai, K. (2016). Experiment on evaporation heat transfer performance of porous surface. In Proceedings of the 15th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2016 (pp. 1-5). [7517520] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ITHERM.2016.7517520

Experiment on evaporation heat transfer performance of porous surface. / Hirasawa, Shigeki; Nakajima, Takuya; Urimoto, Tetsuya; Tsujimoto, Yuya; Takeuchi, Yusuke; Kawanami, Tsuyoshi; Shirai, Katsuaki.

Proceedings of the 15th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2016. Institute of Electrical and Electronics Engineers Inc., 2016. p. 1-5 7517520.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Hirasawa, S, Nakajima, T, Urimoto, T, Tsujimoto, Y, Takeuchi, Y, Kawanami, T & Shirai, K 2016, Experiment on evaporation heat transfer performance of porous surface. in Proceedings of the 15th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2016., 7517520, Institute of Electrical and Electronics Engineers Inc., pp. 1-5, 15th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2016, Las Vegas, United States, 16/5/31. https://doi.org/10.1109/ITHERM.2016.7517520
Hirasawa S, Nakajima T, Urimoto T, Tsujimoto Y, Takeuchi Y, Kawanami T et al. Experiment on evaporation heat transfer performance of porous surface. In Proceedings of the 15th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2016. Institute of Electrical and Electronics Engineers Inc. 2016. p. 1-5. 7517520 https://doi.org/10.1109/ITHERM.2016.7517520
Hirasawa, Shigeki ; Nakajima, Takuya ; Urimoto, Tetsuya ; Tsujimoto, Yuya ; Takeuchi, Yusuke ; Kawanami, Tsuyoshi ; Shirai, Katsuaki. / Experiment on evaporation heat transfer performance of porous surface. Proceedings of the 15th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2016. Institute of Electrical and Electronics Engineers Inc., 2016. pp. 1-5
@inproceedings{2c62b46fa45340feacc967b9ee89663f,
title = "Experiment on evaporation heat transfer performance of porous surface",
abstract = "Enhancement of evaporation heat transfer performance is important for cooling of electronic devices. Evaporation heat transfer coefficient of two types of porous surfaces supplied with water liquid film was studied experimentally. First porous surface was multi layers of meshed plates with micro-channel of 0.3 mm width. Thin water liquid film was supplied to the porous surface by bubbles. Evaporation heat transfer coefficient of the porous surface with one or two layers of meshed plates was 8×104 W/m2K and it was higher than pool boiling heat transfer coefficient. Second porous surface was 1 mm thickness of glass-beads of 0.4 mm in diameter on a heated cupper plate. Water was supplied to the porous layer at the center of the plate. Evaporation heat transfer coefficient was 1000 W/m2K after water was supplied. Evaporation heat transfer coefficient increased to 7000 W/m2K before appearance of dry portion on the plate, because water film thickness in the porous layer was thin.",
keywords = "Cooling electronic devices, cross-grooved surface, dry portion, evaporation, heat transfer coefficient, pool boiling, porous surface, thin glass-beads layer",
author = "Shigeki Hirasawa and Takuya Nakajima and Tetsuya Urimoto and Yuya Tsujimoto and Yusuke Takeuchi and Tsuyoshi Kawanami and Katsuaki Shirai",
year = "2016",
month = "7",
day = "20",
doi = "10.1109/ITHERM.2016.7517520",
language = "English",
pages = "1--5",
booktitle = "Proceedings of the 15th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2016",
publisher = "Institute of Electrical and Electronics Engineers Inc.",

}

TY - GEN

T1 - Experiment on evaporation heat transfer performance of porous surface

AU - Hirasawa, Shigeki

AU - Nakajima, Takuya

AU - Urimoto, Tetsuya

AU - Tsujimoto, Yuya

AU - Takeuchi, Yusuke

AU - Kawanami, Tsuyoshi

AU - Shirai, Katsuaki

PY - 2016/7/20

Y1 - 2016/7/20

N2 - Enhancement of evaporation heat transfer performance is important for cooling of electronic devices. Evaporation heat transfer coefficient of two types of porous surfaces supplied with water liquid film was studied experimentally. First porous surface was multi layers of meshed plates with micro-channel of 0.3 mm width. Thin water liquid film was supplied to the porous surface by bubbles. Evaporation heat transfer coefficient of the porous surface with one or two layers of meshed plates was 8×104 W/m2K and it was higher than pool boiling heat transfer coefficient. Second porous surface was 1 mm thickness of glass-beads of 0.4 mm in diameter on a heated cupper plate. Water was supplied to the porous layer at the center of the plate. Evaporation heat transfer coefficient was 1000 W/m2K after water was supplied. Evaporation heat transfer coefficient increased to 7000 W/m2K before appearance of dry portion on the plate, because water film thickness in the porous layer was thin.

AB - Enhancement of evaporation heat transfer performance is important for cooling of electronic devices. Evaporation heat transfer coefficient of two types of porous surfaces supplied with water liquid film was studied experimentally. First porous surface was multi layers of meshed plates with micro-channel of 0.3 mm width. Thin water liquid film was supplied to the porous surface by bubbles. Evaporation heat transfer coefficient of the porous surface with one or two layers of meshed plates was 8×104 W/m2K and it was higher than pool boiling heat transfer coefficient. Second porous surface was 1 mm thickness of glass-beads of 0.4 mm in diameter on a heated cupper plate. Water was supplied to the porous layer at the center of the plate. Evaporation heat transfer coefficient was 1000 W/m2K after water was supplied. Evaporation heat transfer coefficient increased to 7000 W/m2K before appearance of dry portion on the plate, because water film thickness in the porous layer was thin.

KW - Cooling electronic devices

KW - cross-grooved surface

KW - dry portion

KW - evaporation

KW - heat transfer coefficient

KW - pool boiling

KW - porous surface

KW - thin glass-beads layer

UR - http://www.scopus.com/inward/record.url?scp=84983268623&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84983268623&partnerID=8YFLogxK

U2 - 10.1109/ITHERM.2016.7517520

DO - 10.1109/ITHERM.2016.7517520

M3 - Conference contribution

AN - SCOPUS:84983268623

SP - 1

EP - 5

BT - Proceedings of the 15th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2016

PB - Institute of Electrical and Electronics Engineers Inc.

ER -