Abstract
The relationship between S21 properties and far-field radiated emission has been experimentally characterized for various types of power bus structures. As design parameters of power bus structures in printed circuit boards, the effects of VDD plane configuration, insulator thickness between VDD plane and ground plane, on-board capacitors, and signal routing were investigated. First, S21 properties of solid and electromagnetic band-gap (EBG)-type VDD planes were measured for both with and without on-board capacitors. Then, far-field radiated emission was measured for the combination of these design parameters. On-board capacitors induced stop-band in the low frequency range. It has been found that high level of far-field radiated emission was excited at the almost same frequencies of S21 peaks.
| Original language | English |
|---|---|
| Title of host publication | IEEE International Symposium on Electromagnetic Compatibility |
| Pages | 692-695 |
| Number of pages | 4 |
| Volume | 3 |
| Publication status | Published - 2006 |
| Event | 2006 IEEE International Symposium on Electromagnetic Compatibility, EMC 2006 - Portland, OR Duration: 2006 Aug 14 → 2006 Aug 18 |
Other
| Other | 2006 IEEE International Symposium on Electromagnetic Compatibility, EMC 2006 |
|---|---|
| City | Portland, OR |
| Period | 06/8/14 → 06/8/18 |
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Keywords
- Component
- EBG structure
- EMI
- On-board capacitor
- Power bus structure
- S21 properties
ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Condensed Matter Physics
Cite this
Experimental characterization of relationship between S parameters and radiated emission for solid and EBG types of power bus structures. / Sudo, Toshio; Kato, Toshimi; Ichijo, Seiju.
IEEE International Symposium on Electromagnetic Compatibility. Vol. 3 2006. p. 692-695 1706398.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - Experimental characterization of relationship between S parameters and radiated emission for solid and EBG types of power bus structures
AU - Sudo, Toshio
AU - Kato, Toshimi
AU - Ichijo, Seiju
PY - 2006
Y1 - 2006
N2 - The relationship between S21 properties and far-field radiated emission has been experimentally characterized for various types of power bus structures. As design parameters of power bus structures in printed circuit boards, the effects of VDD plane configuration, insulator thickness between VDD plane and ground plane, on-board capacitors, and signal routing were investigated. First, S21 properties of solid and electromagnetic band-gap (EBG)-type VDD planes were measured for both with and without on-board capacitors. Then, far-field radiated emission was measured for the combination of these design parameters. On-board capacitors induced stop-band in the low frequency range. It has been found that high level of far-field radiated emission was excited at the almost same frequencies of S21 peaks.
AB - The relationship between S21 properties and far-field radiated emission has been experimentally characterized for various types of power bus structures. As design parameters of power bus structures in printed circuit boards, the effects of VDD plane configuration, insulator thickness between VDD plane and ground plane, on-board capacitors, and signal routing were investigated. First, S21 properties of solid and electromagnetic band-gap (EBG)-type VDD planes were measured for both with and without on-board capacitors. Then, far-field radiated emission was measured for the combination of these design parameters. On-board capacitors induced stop-band in the low frequency range. It has been found that high level of far-field radiated emission was excited at the almost same frequencies of S21 peaks.
KW - Component
KW - EBG structure
KW - EMI
KW - On-board capacitor
KW - Power bus structure
KW - S21 properties
UR - http://www.scopus.com/inward/record.url?scp=34047232002&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=34047232002&partnerID=8YFLogxK
M3 - Conference contribution
SN - 142440293X
SN - 9781424402939
VL - 3
SP - 692
EP - 695
BT - IEEE International Symposium on Electromagnetic Compatibility
ER -