Experimental characterization of simultaneous switching noise for multichip module

Kenji Ito, Katsuto Kato, Naohiko Hirano, Toshio Sudo

Research output: Contribution to conferencePaperpeer-review

2 Citations (Scopus)

Abstract

CMOS-based multichip modules have been actively developed for achieving high performance and high speed systems. Simultaneous switching noise (SSN) induced by CMOS output buffers is a serious issue in multichip modules as well as single-chip packages to ensure stable operation and to derive inherent speed performance. Multichip modules are expected to have smaller switching noise level than the case of single-chip packages by removing a first-level package and its parasitics. This paper reports the measurement results of switching noises for different types of MCMs using a switching noise generating chip. Two types of test vehicles were fabricated and measurement results were compared. Noise distribution on a ground plane was also measured.

Original languageEnglish
Pages217-220
Number of pages4
Publication statusPublished - 1995 Jan 1
EventProceedings of the 1995 IEEE Multi-Chip Module Conference - Santa Cruz, CA, USA
Duration: 1995 Jan 311995 Feb 2

Other

OtherProceedings of the 1995 IEEE Multi-Chip Module Conference
CitySanta Cruz, CA, USA
Period95/1/3195/2/2

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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