Experimental characterization of simultaneous switching noise for multichip modules

Kenji Ito, Katsuto Kato, Naohiko Hirano, Toshio Sudo

Research output: Contribution to journalArticle

4 Citations (Scopus)

Abstract

CMOS-based multichip modules have been actively developed for achieving high performance and high speed systems. Simultaneous switching noise (SSN) induced by CMOS output buffers is a serious problem for both multichip modules (MCM's) and single-chip packages (SCP's); the problem must be solved in order to ensure stable operation and inherent speed performance. Multichip modules are expected to have a smaller switching noise level than SCP's due to the removal of the first-level package and its parasitics. This paper reports the results of switching noise measurements for different types of MCM's using a switching noise generating chip. Two types of test vehicles were fabricated and measurement results were compared. Noise distribution on a ground plane was also measured.

Original languageEnglish
Pages (from-to)609-613
Number of pages5
JournalIEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging
Volume18
Issue number4
DOIs
Publication statusPublished - 1995 Nov

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Multichip modules

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Experimental characterization of simultaneous switching noise for multichip modules. / Ito, Kenji; Kato, Katsuto; Hirano, Naohiko; Sudo, Toshio.

In: IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, Vol. 18, No. 4, 11.1995, p. 609-613.

Research output: Contribution to journalArticle

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