Experimental Characterization of Simultaneous Switching Noise for Multichip Modules

Kenji Ito, Naohiko Hirano, Toshio Sudo

Research output: Contribution to journalArticlepeer-review

4 Citations (Scopus)


CMOS-based multichip modules have been actively developed for achieving high performance and high speed systems. Simultaneous switching noise (SSN) induced by CMOS output buffers is a serious problem for both multichip modules (MCM's) and single-chip packages (SCP's); the problem must be solved in order to ensure stable operation and inherent speed performance. Multichip modules are expected to have a smaller switching noise level than SCP's due to the removal of the first-level package and its parasitics. This paper reports the results of switching noise measurements for different types of MCM's using a switching noise generating chip. Two types of test vehicles were fabricated and measurement results were compared. Noise distribution on a ground plane was also measured.

Original languageEnglish
Pages (from-to)609-613
Number of pages5
JournalIEEE Transactions on Components Packaging and Manufacturing Technology Part B
Issue number4
Publication statusPublished - 1995 Nov


  • MCM-C
  • MCM-D
  • Multichip module
  • ground bounce
  • inductance
  • noise distribution
  • simultaneous switching noise

ASJC Scopus subject areas

  • Engineering(all)


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