Fabrication of Monocrystalline-Based Composite PZT Thin Film with Polycrystalline Crack Stopper Structure

Yu Katsumata, Shinya Yoshida, Shuji Tanaka

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper reports on a new type of Pb(Zr, Ti)O3 (PZT) thin film, where monocrystalline (Mono) PZT is sectioned by narrow mesh-like polycrystalline (Poly) PZT. This Mono-Poly composite PZT thin film basically has unique characteristics of the Mono PZT such as reasonably high piezoelectric constant and low dielectric constant. In addition, accidental crack propagation in the Mono PZT is stopped by the Poly PZT. The motivation of this study is to solve the easy-to-fracture nature of single crystals, which is the case with Mono PZT. We successfully sputter-deposited the Mono-Poly composite thin film on a Si substrate covered with a patterned underlayer. Indentation tests demonstrated that the Poly PZT patterns prevented the crack propagation across Mono PZT areas. That is expected to improve the mechanical robustness of the entire film.

Original languageEnglish
Title of host publication35th IEEE International Conference on Micro Electro Mechanical Systems Conference, MEMS 2022
PublisherIEEE Computer Society
Pages543-546
Number of pages4
ISBN (Electronic)9781665409117
DOIs
Publication statusPublished - 2022
Externally publishedYes
Event35th IEEE International Conference on Micro Electro Mechanical Systems Conference, MEMS 2022 - Tokyo, Japan
Duration: 2022 Jan 92022 Jan 13

Publication series

NameIEEE Symposium on Mass Storage Systems and Technologies
Volume2022-January
ISSN (Print)2160-1968

Conference

Conference35th IEEE International Conference on Micro Electro Mechanical Systems Conference, MEMS 2022
Country/TerritoryJapan
CityTokyo
Period22/1/922/1/13

Keywords

  • Pb(Zr
  • Ti)O3 (PZT)
  • composite
  • indentation
  • mechanical robustness
  • monocrystalline thin film
  • polycrystalline thin film

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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