Fabrication processes of magneto-optic waveguides with Si guiding layer for optical nonreciprocal devices

Salinee Choowitsakunlert, Kenji Takagiwa, Takuya Kobashigawa, Nariaki Hosoya, Rardchawadee Silapunt, Hideki Yokoi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

An optical isolator employing a nonreciprocal guided-radiation mode conversion has been investigated. This device consists of a rib-type magneto-optic waveguide with a Si guiding layer. Relationship of waveguide parameters for isolator operation was clarified for various gaps. Fabrication processes of the magneto-optic waveguides are discussed by comparing waveguide parameters for isolator operation.

Original languageEnglish
Title of host publicationProceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Number of pages1
ISBN (Electronic)9784904743034
DOIs
Publication statusPublished - 2017 Jun 13
Event5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017 - Tokyo, Japan
Duration: 2017 May 162017 May 18

Other

Other5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017
CountryJapan
CityTokyo
Period17/5/1617/5/18

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering
  • Electronic, Optical and Magnetic Materials
  • Surfaces, Coatings and Films

Fingerprint Dive into the research topics of 'Fabrication processes of magneto-optic waveguides with Si guiding layer for optical nonreciprocal devices'. Together they form a unique fingerprint.

  • Cite this

    Choowitsakunlert, S., Takagiwa, K., Kobashigawa, T., Hosoya, N., Silapunt, R., & Yokoi, H. (2017). Fabrication processes of magneto-optic waveguides with Si guiding layer for optical nonreciprocal devices. In Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017 [7947478] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.23919/LTB-3D.2017.7947478