Fabrication processes of soi structure for optical nonreciprocal devices

Salinee Choowitsakunlert, Kenji Takagiwa, Takuya Kobashigawa, Nariaki Hosoya, Rardchawadee Silapunt, Hideki Yokoi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Fabrication processes of a magneto-optic waveguide with a Si guiding layer for an optical isolator employing a nonreciprocal guided-radiation mode conversion are investigated. The optical isolator is constructed on a silicon-on-insulator (SOI) structure. The magneto-optic waveguide is fabricated by bonding the Si guiding layer with a cerium-substituted yttrium iron garnet (Ce: YIG). The relationship of waveguide geometric parameters is determined at a wavelength of 1550 nm. The results show that larger tolerance for isolator operation can be obtained at smaller gaps between Si and Ce: YIG. Bonding processes including photosensitive adhesive bonding and surface activated bonding are then compared. It is found that the surface activated bonding process is easier to control and more promising than the photosensitive adhesive bonding.

Original languageEnglish
Title of host publicationAdvanced Materials and Engineering Materials VII
EditorsPeng Sheng Wei
PublisherTrans Tech Publications Ltd
Pages107-112
Number of pages6
ISBN (Print)9783035713718
DOIs
Publication statusPublished - 2018 Jan 1
Event7th International Conference on Advanced Materials and Engineering Materials, ICAMEM 2018 - Bangkok, Thailand
Duration: 2018 May 172018 May 18

Publication series

NameKey Engineering Materials
Volume777 KEM
ISSN (Print)1013-9826

Other

Other7th International Conference on Advanced Materials and Engineering Materials, ICAMEM 2018
CountryThailand
CityBangkok
Period18/5/1718/5/18

Fingerprint

Optical devices
Fabrication
Cerium
Yttrium
Magnetooptical effects
Waveguides
Garnets
Adhesives
Iron
Silicon
Radiation
Wavelength

Keywords

  • Photosensitive adhesive bonding
  • Silicon-on-insulator (SOI)
  • Surface activated bonding

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

Choowitsakunlert, S., Takagiwa, K., Kobashigawa, T., Hosoya, N., Silapunt, R., & Yokoi, H. (2018). Fabrication processes of soi structure for optical nonreciprocal devices. In P. S. Wei (Ed.), Advanced Materials and Engineering Materials VII (pp. 107-112). (Key Engineering Materials; Vol. 777 KEM). Trans Tech Publications Ltd. https://doi.org/10.4028/www.scientific.net/KEM.777.107

Fabrication processes of soi structure for optical nonreciprocal devices. / Choowitsakunlert, Salinee; Takagiwa, Kenji; Kobashigawa, Takuya; Hosoya, Nariaki; Silapunt, Rardchawadee; Yokoi, Hideki.

Advanced Materials and Engineering Materials VII. ed. / Peng Sheng Wei. Trans Tech Publications Ltd, 2018. p. 107-112 (Key Engineering Materials; Vol. 777 KEM).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Choowitsakunlert, S, Takagiwa, K, Kobashigawa, T, Hosoya, N, Silapunt, R & Yokoi, H 2018, Fabrication processes of soi structure for optical nonreciprocal devices. in PS Wei (ed.), Advanced Materials and Engineering Materials VII. Key Engineering Materials, vol. 777 KEM, Trans Tech Publications Ltd, pp. 107-112, 7th International Conference on Advanced Materials and Engineering Materials, ICAMEM 2018, Bangkok, Thailand, 18/5/17. https://doi.org/10.4028/www.scientific.net/KEM.777.107
Choowitsakunlert S, Takagiwa K, Kobashigawa T, Hosoya N, Silapunt R, Yokoi H. Fabrication processes of soi structure for optical nonreciprocal devices. In Wei PS, editor, Advanced Materials and Engineering Materials VII. Trans Tech Publications Ltd. 2018. p. 107-112. (Key Engineering Materials). https://doi.org/10.4028/www.scientific.net/KEM.777.107
Choowitsakunlert, Salinee ; Takagiwa, Kenji ; Kobashigawa, Takuya ; Hosoya, Nariaki ; Silapunt, Rardchawadee ; Yokoi, Hideki. / Fabrication processes of soi structure for optical nonreciprocal devices. Advanced Materials and Engineering Materials VII. editor / Peng Sheng Wei. Trans Tech Publications Ltd, 2018. pp. 107-112 (Key Engineering Materials).
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