Fatigue life and fracture behavior of micro size Sn-Ag-Cu solder joint

Tashiro Naoki, Yoshiharu Kariya, Yoshihiko Kanda

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

The influence of the joint size on low cycle fatigue characteristic of Sn-Ag-Cu has been investigated by a micro size joint specimen fabricated using solder balls. Although the effect of joint size on crack initiation life is not obvious at 298K, the reduction of the joint size changes the cyclic strain hardening nature and the fracture behavior that induces the life reduction at 398K. With a decrease in size, the failure mechanism transforms from a transgranular fracture to an intergranular fracture at the high energy grain boundary that is formed by high angle boundary formation following dynamic recovery in whole of joint. Therefore, the failure life is greatly reduced as a complete failure occurs simultaneously with the crack initiation at the grain boundaries. This is more remarkable at higher temperatures.

Original languageEnglish
Title of host publicationASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011
Pages707-712
Number of pages6
DOIs
Publication statusPublished - 2011 Dec 1
EventASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011 - Portland, OR, United States
Duration: 2011 Jul 62011 Jul 8

Publication series

NameASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011
Volume2

Conference

ConferenceASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011
CountryUnited States
CityPortland, OR
Period11/7/611/7/8

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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    Naoki, T., Kariya, Y., & Kanda, Y. (2011). Fatigue life and fracture behavior of micro size Sn-Ag-Cu solder joint. In ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011 (pp. 707-712). (ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011; Vol. 2). https://doi.org/10.1115/IPACK2011-52104