Abstract
The mechanical shear fatigue test has been performed to investigate the fatigue properties of Sn-1.2mass%Ag-0.5mass%Cu-0.05mass%Ni for flip chip interconnections. The low cycle fatigue endurance of the alloy is almost equivalent to that of Sn-3mass%Ag-0.5mass%Cu alloy, even though the fatigue endurance of Sn-lmass%Ag-0.5mass%Cu alloy was poorer than that of the 3mass%Ag alloy. Adding Ni to low silver content Sn-Ag-Cu alloy leaded to fine microstructure, and the microstructure had a network structure of Ag3Sn intermetallic compound together with fine Cu-Sn intermetallic compound. The microstructure resulted in high strain hardening exponents, which leaded to good low cycle fatigue endurance of the alloy.
| Original language | English |
|---|---|
| Title of host publication | Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference |
| Editors | K. Ramakrishna, B.G. Sammakia, J.R. Culham, Y.K. Joshi, J. Hock-Lye Pang, K. Jonnalagadda, S. Tonapi, G. Refai-Ahmed, T.Y. Tom Lee, D.W. Copeland, M.J. Ellesworth Jr. |
| Pages | 103-108 |
| Number of pages | 6 |
| Volume | 2 |
| Publication status | Published - 2004 |
| Externally published | Yes |
| Event | ITherm 2004 - Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Las Vegas, NV Duration: 2004 Jun 1 → 2004 Jun 4 |
Other
| Other | ITherm 2004 - Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems |
|---|---|
| City | Las Vegas, NV |
| Period | 04/6/1 → 04/6/4 |
Fingerprint
Keywords
- BGA joints
- Fatigue life
- Flip-chip
- Lead-free solder
- Low silver content
- Ni addition
- Shear Fatigue
- Sn-Ag-Cu
ASJC Scopus subject areas
- Engineering(all)
Cite this
Fatigue life enhancement of low silver content Sn-Ag-Cu flip-chip interconnects by Ni addition. / Kariya, Yoshiharu; Hosoi, Takuya; Kimura, Takashi; Terashima, Shinichi; Tanaka, Masamoto; Suga, Tadatomo.
Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. ed. / K. Ramakrishna; B.G. Sammakia; J.R. Culham; Y.K. Joshi; J. Hock-Lye Pang; K. Jonnalagadda; S. Tonapi; G. Refai-Ahmed; T.Y. Tom Lee; D.W. Copeland; M.J. Ellesworth Jr. Vol. 2 2004. p. 103-108.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - Fatigue life enhancement of low silver content Sn-Ag-Cu flip-chip interconnects by Ni addition
AU - Kariya, Yoshiharu
AU - Hosoi, Takuya
AU - Kimura, Takashi
AU - Terashima, Shinichi
AU - Tanaka, Masamoto
AU - Suga, Tadatomo
PY - 2004
Y1 - 2004
N2 - The mechanical shear fatigue test has been performed to investigate the fatigue properties of Sn-1.2mass%Ag-0.5mass%Cu-0.05mass%Ni for flip chip interconnections. The low cycle fatigue endurance of the alloy is almost equivalent to that of Sn-3mass%Ag-0.5mass%Cu alloy, even though the fatigue endurance of Sn-lmass%Ag-0.5mass%Cu alloy was poorer than that of the 3mass%Ag alloy. Adding Ni to low silver content Sn-Ag-Cu alloy leaded to fine microstructure, and the microstructure had a network structure of Ag3Sn intermetallic compound together with fine Cu-Sn intermetallic compound. The microstructure resulted in high strain hardening exponents, which leaded to good low cycle fatigue endurance of the alloy.
AB - The mechanical shear fatigue test has been performed to investigate the fatigue properties of Sn-1.2mass%Ag-0.5mass%Cu-0.05mass%Ni for flip chip interconnections. The low cycle fatigue endurance of the alloy is almost equivalent to that of Sn-3mass%Ag-0.5mass%Cu alloy, even though the fatigue endurance of Sn-lmass%Ag-0.5mass%Cu alloy was poorer than that of the 3mass%Ag alloy. Adding Ni to low silver content Sn-Ag-Cu alloy leaded to fine microstructure, and the microstructure had a network structure of Ag3Sn intermetallic compound together with fine Cu-Sn intermetallic compound. The microstructure resulted in high strain hardening exponents, which leaded to good low cycle fatigue endurance of the alloy.
KW - BGA joints
KW - Fatigue life
KW - Flip-chip
KW - Lead-free solder
KW - Low silver content
KW - Ni addition
KW - Shear Fatigue
KW - Sn-Ag-Cu
UR - http://www.scopus.com/inward/record.url?scp=4444344332&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=4444344332&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:4444344332
VL - 2
SP - 103
EP - 108
BT - Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference
A2 - Ramakrishna, K.
A2 - Sammakia, B.G.
A2 - Culham, J.R.
A2 - Joshi, Y.K.
A2 - Hock-Lye Pang, J.
A2 - Jonnalagadda, K.
A2 - Tonapi, S.
A2 - Refai-Ahmed, G.
A2 - Tom Lee, T.Y.
A2 - Copeland, D.W.
A2 - Ellesworth Jr., M.J.
ER -