Fatigue life enhancement of low silver content Sn-Ag-Cu flip-chip interconnects by Ni addition

Yoshiharu Kariya; Takuya Hosoi; Takashi Kimura; Shinichi Terashima; Masamoto Tanaka; Tadatomo Suga

Fatigue life enhancement of low silver content Sn-Ag-Cu flip-chip interconnects by Ni addition

Yoshiharu Kariya, Takuya Hosoi, Takashi Kimura, Shinichi Terashima, Masamoto Tanaka, Tadatomo Suga

Research output: Contribution to conference › Paper › peer-review

Abstract

The mechanical shear fatigue test has been performed to investigate the fatigue properties of Sn-1.2mass%Ag-0.5mass%Cu-0.05mass%Ni for flip chip interconnections. The low cycle fatigue endurance of the alloy is almost equivalent to that of Sn-3mass%Ag-0.5mass%Cu alloy, even though the fatigue endurance of Sn-lmass%Ag-0.5mass%Cu alloy was poorer than that of the 3mass%Ag alloy. Adding Ni to low silver content Sn-Ag-Cu alloy leaded to fine microstructure, and the microstructure had a network structure of Ag3Sn intermetallic compound together with fine Cu-Sn intermetallic compound. The microstructure resulted in high strain hardening exponents, which leaded to good low cycle fatigue endurance of the alloy.

Original language	English
Pages	103-108
Number of pages	6
Publication status	Published - 2004 Sep 20
Externally published	Yes
Event	ITherm 2004 - Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Las Vegas, NV, United States Duration: 2004 Jun 1 → 2004 Jun 4

Conference

Conference	ITherm 2004 - Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
Country	United States
City	Las Vegas, NV
Period	04/6/1 → 04/6/4

Keywords

BGA joints
Fatigue life
Flip-chip
Lead-free solder
Low silver content
Ni addition
Shear Fatigue
Sn-Ag-Cu

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Electrical and Electronic Engineering
Materials Chemistry

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Fatigue life enhancement of low silver content Sn-Ag-Cu flip-chip interconnects by Ni addition. / Kariya, Yoshiharu; Hosoi, Takuya; Kimura, Takashi; Terashima, Shinichi; Tanaka, Masamoto; Suga, Tadatomo.

2004. 103-108 Paper presented at ITherm 2004 - Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, United States.

Research output: Contribution to conference › Paper › peer-review

Kariya, Yoshiharu ; Hosoi, Takuya ; Kimura, Takashi ; Terashima, Shinichi ; Tanaka, Masamoto ; Suga, Tadatomo. / Fatigue life enhancement of low silver content Sn-Ag-Cu flip-chip interconnects by Ni addition. Paper presented at ITherm 2004 - Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, United States.6 p.

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title = "Fatigue life enhancement of low silver content Sn-Ag-Cu flip-chip interconnects by Ni addition",

abstract = "The mechanical shear fatigue test has been performed to investigate the fatigue properties of Sn-1.2mass%Ag-0.5mass%Cu-0.05mass%Ni for flip chip interconnections. The low cycle fatigue endurance of the alloy is almost equivalent to that of Sn-3mass%Ag-0.5mass%Cu alloy, even though the fatigue endurance of Sn-lmass%Ag-0.5mass%Cu alloy was poorer than that of the 3mass%Ag alloy. Adding Ni to low silver content Sn-Ag-Cu alloy leaded to fine microstructure, and the microstructure had a network structure of Ag3Sn intermetallic compound together with fine Cu-Sn intermetallic compound. The microstructure resulted in high strain hardening exponents, which leaded to good low cycle fatigue endurance of the alloy.",

keywords = "BGA joints, Fatigue life, Flip-chip, Lead-free solder, Low silver content, Ni addition, Shear Fatigue, Sn-Ag-Cu",

author = "Yoshiharu Kariya and Takuya Hosoi and Takashi Kimura and Shinichi Terashima and Masamoto Tanaka and Tadatomo Suga",

year = "2004",

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AU - Kariya, Yoshiharu

AU - Hosoi, Takuya

AU - Kimura, Takashi

AU - Terashima, Shinichi

AU - Tanaka, Masamoto

AU - Suga, Tadatomo

PY - 2004/9/20

Y1 - 2004/9/20

N2 - The mechanical shear fatigue test has been performed to investigate the fatigue properties of Sn-1.2mass%Ag-0.5mass%Cu-0.05mass%Ni for flip chip interconnections. The low cycle fatigue endurance of the alloy is almost equivalent to that of Sn-3mass%Ag-0.5mass%Cu alloy, even though the fatigue endurance of Sn-lmass%Ag-0.5mass%Cu alloy was poorer than that of the 3mass%Ag alloy. Adding Ni to low silver content Sn-Ag-Cu alloy leaded to fine microstructure, and the microstructure had a network structure of Ag3Sn intermetallic compound together with fine Cu-Sn intermetallic compound. The microstructure resulted in high strain hardening exponents, which leaded to good low cycle fatigue endurance of the alloy.

AB - The mechanical shear fatigue test has been performed to investigate the fatigue properties of Sn-1.2mass%Ag-0.5mass%Cu-0.05mass%Ni for flip chip interconnections. The low cycle fatigue endurance of the alloy is almost equivalent to that of Sn-3mass%Ag-0.5mass%Cu alloy, even though the fatigue endurance of Sn-lmass%Ag-0.5mass%Cu alloy was poorer than that of the 3mass%Ag alloy. Adding Ni to low silver content Sn-Ag-Cu alloy leaded to fine microstructure, and the microstructure had a network structure of Ag3Sn intermetallic compound together with fine Cu-Sn intermetallic compound. The microstructure resulted in high strain hardening exponents, which leaded to good low cycle fatigue endurance of the alloy.

KW - BGA joints

KW - Fatigue life

KW - Flip-chip

KW - Lead-free solder

KW - Low silver content

KW - Ni addition

KW - Shear Fatigue

KW - Sn-Ag-Cu

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