Abstract
The mechanical shear fatigue test has been performed to investigate the fatigue properties of Sn-1.2mass%Ag-0.5mass%Cu-0.05mass%Ni for flip chip interconnections. The low cycle fatigue endurance of the alloy is almost equivalent to that of Sn-3mass%Ag-0.5mass%Cu alloy, even though the fatigue endurance of Sn-lmass%Ag-0.5mass%Cu alloy was poorer than that of the 3mass%Ag alloy. Adding Ni to low silver content Sn-Ag-Cu alloy leaded to fine microstructure, and the microstructure had a network structure of Ag3Sn intermetallic compound together with fine Cu-Sn intermetallic compound. The microstructure resulted in high strain hardening exponents, which leaded to good low cycle fatigue endurance of the alloy.
| Original language | English |
|---|---|
| Pages | 103-108 |
| Number of pages | 6 |
| Publication status | Published - 2004 Sep 20 |
| Event | ITherm 2004 - Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Las Vegas, NV, United States Duration: 2004 Jun 1 → 2004 Jun 4 |
Conference
| Conference | ITherm 2004 - Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems |
|---|---|
| Country | United States |
| City | Las Vegas, NV |
| Period | 04/6/1 → 04/6/4 |
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Keywords
- BGA joints
- Fatigue life
- Flip-chip
- Lead-free solder
- Low silver content
- Ni addition
- Shear Fatigue
- Sn-Ag-Cu
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Electrical and Electronic Engineering
- Materials Chemistry
Cite this
Kariya, Y., Hosoi, T., Kimura, T., Terashima, S., Tanaka, M., & Suga, T. (2004). Fatigue life enhancement of low silver content Sn-Ag-Cu flip-chip interconnects by Ni addition. 103-108. Paper presented at ITherm 2004 - Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, United States.