Fatigue life enhancement of low silver content Sn-Ag-Cu flip-chip interconnects by Ni addition

Yoshiharu Kariya, Takuya Hosoi, Takashi Kimura, Shinichi Terashima, Masamoto Tanaka, Tadatomo Suga

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

The mechanical shear fatigue test has been performed to investigate the fatigue properties of Sn-1.2mass%Ag-0.5mass%Cu-0.05mass%Ni for flip chip interconnections. The low cycle fatigue endurance of the alloy is almost equivalent to that of Sn-3mass%Ag-0.5mass%Cu alloy, even though the fatigue endurance of Sn-lmass%Ag-0.5mass%Cu alloy was poorer than that of the 3mass%Ag alloy. Adding Ni to low silver content Sn-Ag-Cu alloy leaded to fine microstructure, and the microstructure had a network structure of Ag3Sn intermetallic compound together with fine Cu-Sn intermetallic compound. The microstructure resulted in high strain hardening exponents, which leaded to good low cycle fatigue endurance of the alloy.

Original languageEnglish
Title of host publicationThermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference
EditorsK. Ramakrishna, B.G. Sammakia, J.R. Culham, Y.K. Joshi, J. Hock-Lye Pang, K. Jonnalagadda, S. Tonapi, G. Refai-Ahmed, T.Y. Tom Lee, D.W. Copeland, M.J. Ellesworth Jr.
Pages103-108
Number of pages6
Volume2
Publication statusPublished - 2004
Externally publishedYes
EventITherm 2004 - Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Las Vegas, NV
Duration: 2004 Jun 12004 Jun 4

Other

OtherITherm 2004 - Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
CityLas Vegas, NV
Period04/6/104/6/4

Fingerprint

Silver
Fatigue of materials
Durability
Microstructure
Intermetallics
Strain hardening

Keywords

  • BGA joints
  • Fatigue life
  • Flip-chip
  • Lead-free solder
  • Low silver content
  • Ni addition
  • Shear Fatigue
  • Sn-Ag-Cu

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Kariya, Y., Hosoi, T., Kimura, T., Terashima, S., Tanaka, M., & Suga, T. (2004). Fatigue life enhancement of low silver content Sn-Ag-Cu flip-chip interconnects by Ni addition. In K. Ramakrishna, B. G. Sammakia, J. R. Culham, Y. K. Joshi, J. Hock-Lye Pang, K. Jonnalagadda, S. Tonapi, G. Refai-Ahmed, T. Y. Tom Lee, D. W. Copeland, ... M. J. Ellesworth Jr. (Eds.), Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference (Vol. 2, pp. 103-108)

Fatigue life enhancement of low silver content Sn-Ag-Cu flip-chip interconnects by Ni addition. / Kariya, Yoshiharu; Hosoi, Takuya; Kimura, Takashi; Terashima, Shinichi; Tanaka, Masamoto; Suga, Tadatomo.

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. ed. / K. Ramakrishna; B.G. Sammakia; J.R. Culham; Y.K. Joshi; J. Hock-Lye Pang; K. Jonnalagadda; S. Tonapi; G. Refai-Ahmed; T.Y. Tom Lee; D.W. Copeland; M.J. Ellesworth Jr. Vol. 2 2004. p. 103-108.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Kariya, Y, Hosoi, T, Kimura, T, Terashima, S, Tanaka, M & Suga, T 2004, Fatigue life enhancement of low silver content Sn-Ag-Cu flip-chip interconnects by Ni addition. in K Ramakrishna, BG Sammakia, JR Culham, YK Joshi, J Hock-Lye Pang, K Jonnalagadda, S Tonapi, G Refai-Ahmed, TY Tom Lee, DW Copeland & MJ Ellesworth Jr. (eds), Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. vol. 2, pp. 103-108, ITherm 2004 - Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, 04/6/1.
Kariya Y, Hosoi T, Kimura T, Terashima S, Tanaka M, Suga T. Fatigue life enhancement of low silver content Sn-Ag-Cu flip-chip interconnects by Ni addition. In Ramakrishna K, Sammakia BG, Culham JR, Joshi YK, Hock-Lye Pang J, Jonnalagadda K, Tonapi S, Refai-Ahmed G, Tom Lee TY, Copeland DW, Ellesworth Jr. MJ, editors, Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. Vol. 2. 2004. p. 103-108
Kariya, Yoshiharu ; Hosoi, Takuya ; Kimura, Takashi ; Terashima, Shinichi ; Tanaka, Masamoto ; Suga, Tadatomo. / Fatigue life enhancement of low silver content Sn-Ag-Cu flip-chip interconnects by Ni addition. Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. editor / K. Ramakrishna ; B.G. Sammakia ; J.R. Culham ; Y.K. Joshi ; J. Hock-Lye Pang ; K. Jonnalagadda ; S. Tonapi ; G. Refai-Ahmed ; T.Y. Tom Lee ; D.W. Copeland ; M.J. Ellesworth Jr. Vol. 2 2004. pp. 103-108
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abstract = "The mechanical shear fatigue test has been performed to investigate the fatigue properties of Sn-1.2mass{\%}Ag-0.5mass{\%}Cu-0.05mass{\%}Ni for flip chip interconnections. The low cycle fatigue endurance of the alloy is almost equivalent to that of Sn-3mass{\%}Ag-0.5mass{\%}Cu alloy, even though the fatigue endurance of Sn-lmass{\%}Ag-0.5mass{\%}Cu alloy was poorer than that of the 3mass{\%}Ag alloy. Adding Ni to low silver content Sn-Ag-Cu alloy leaded to fine microstructure, and the microstructure had a network structure of Ag3Sn intermetallic compound together with fine Cu-Sn intermetallic compound. The microstructure resulted in high strain hardening exponents, which leaded to good low cycle fatigue endurance of the alloy.",
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