Fatigue Life Enhancement of Low Silver Content Sn-Ag-Cu Flip-Chip Interconnects by Small Amount of Ni Addition

Yoshiharu Kariya, Takashi Kimura, Shinichi Terashiama, Masamoto Tanaka, Tadatomo Suga

Research output: Contribution to journalArticle

Original languageEnglish
JournalDefault journal
Publication statusPublished - 2003 Oct 1

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