Fatigue Life Enhancement of Low Silver Content Sn-Ag-Cu Flip-Chip Interconnects by Small Amount of Ni Addition

Yoshiharu Kariya, Takashi Kimura, Shinichi Terashiama, Masamoto Tanaka, Tadatomo Suga

Research output: Contribution to journal › Article › peer-review

Cite this

@article{4d115719bc30433589ca8d067a37c8c7,

title = "Fatigue Life Enhancement of Low Silver Content Sn-Ag-Cu Flip-Chip Interconnects by Small Amount of Ni Addition",

author = "Yoshiharu Kariya and Takashi Kimura and Shinichi Terashiama and Masamoto Tanaka and Tadatomo Suga",

year = "2003",

month = oct,

day = "1",

language = "English",

journal = "Default journal",

}