Fatigue Life Enhancement of Low Silver Content Sn-Ag-Cu Flip-Chip Interconnects by Small Amount of Ni Addition

Yoshiharu Kariya, Takashi Kimura, Shinichi Terashiama, Masamoto Tanaka, Tadatomo Suga

Research output: Contribution to journalArticle

Original languageEnglish
JournalDefault journal
Publication statusPublished - 2003 Oct 1

Cite this

Fatigue Life Enhancement of Low Silver Content Sn-Ag-Cu Flip-Chip Interconnects by Small Amount of Ni Addition. / Kariya, Yoshiharu; Kimura, Takashi; Terashiama, Shinichi; Tanaka, Masamoto; Suga, Tadatomo.

In: Default journal, 01.10.2003.

Research output: Contribution to journalArticle

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AU - Kimura, Takashi

AU - Terashiama, Shinichi

AU - Tanaka, Masamoto

AU - Suga, Tadatomo

PY - 2003/10/1

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