Fatigue life enhancement of low silver content Sn-Ag-Cu flip-chip interconnects by Ni addition

Yoshiharu Kariya, Takuya Hosoi, Takashi Kimura, Shinichi Terashima, Masamoto Tanaka, Tadatomo Suga

Research output: Contribution to conferencePaperpeer-review

4 Citations (Scopus)

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Physics & Astronomy

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Chemical Compounds