Flexible Electrostatic Adhesive Device and its Performance Evaluations

Kotaro Takahashi, Tadahiro Hasegawa, Shinrichi Yuta

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A flexible electrostatic adhesive device was modified successfully to improve an aging characteristics. The experimental results using a previous electrostatic adhesive device has shown that, in concrete wall, the maximum adhesive force was 1kgf or more during applied voltage 10kV. However, problems that the adhesive force decreases depending on aging arose. To solve the problem, the design of the electrostatic device was modified. Thereby, the electrostatic adhesive device succeeded that an adhesive force was generated 1kgf or more during a month or more. The flexible electrostatic adhesive device is useful for a practical use to stick to an inspection apparatus on a concrete wall of a bridge or a tunnel.

Original languageEnglish
Title of host publicationProceedings of the 2019 IEEE/SICE International Symposium on System Integration, SII 2019
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages679-682
Number of pages4
ISBN (Electronic)9781538636152
DOIs
Publication statusPublished - 2019 Apr 25
Event2019 IEEE/SICE International Symposium on System Integration, SII 2019 - Paris, France
Duration: 2019 Jan 142019 Jan 16

Publication series

NameProceedings of the 2019 IEEE/SICE International Symposium on System Integration, SII 2019

Conference

Conference2019 IEEE/SICE International Symposium on System Integration, SII 2019
CountryFrance
CityParis
Period19/1/1419/1/16

Fingerprint

adhesives
Electrostatics
Adhesives
electrostatics
evaluation
Electrostatic devices
Aging of materials
Concretes
tunnels
inspection
Tunnels
Inspection
Electric potential
electric potential

ASJC Scopus subject areas

  • Atomic and Molecular Physics, and Optics
  • Electrical and Electronic Engineering

Cite this

Takahashi, K., Hasegawa, T., & Yuta, S. (2019). Flexible Electrostatic Adhesive Device and its Performance Evaluations. In Proceedings of the 2019 IEEE/SICE International Symposium on System Integration, SII 2019 (pp. 679-682). [8700457] (Proceedings of the 2019 IEEE/SICE International Symposium on System Integration, SII 2019). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/SII.2019.8700457

Flexible Electrostatic Adhesive Device and its Performance Evaluations. / Takahashi, Kotaro; Hasegawa, Tadahiro; Yuta, Shinrichi.

Proceedings of the 2019 IEEE/SICE International Symposium on System Integration, SII 2019. Institute of Electrical and Electronics Engineers Inc., 2019. p. 679-682 8700457 (Proceedings of the 2019 IEEE/SICE International Symposium on System Integration, SII 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Takahashi, K, Hasegawa, T & Yuta, S 2019, Flexible Electrostatic Adhesive Device and its Performance Evaluations. in Proceedings of the 2019 IEEE/SICE International Symposium on System Integration, SII 2019., 8700457, Proceedings of the 2019 IEEE/SICE International Symposium on System Integration, SII 2019, Institute of Electrical and Electronics Engineers Inc., pp. 679-682, 2019 IEEE/SICE International Symposium on System Integration, SII 2019, Paris, France, 19/1/14. https://doi.org/10.1109/SII.2019.8700457
Takahashi K, Hasegawa T, Yuta S. Flexible Electrostatic Adhesive Device and its Performance Evaluations. In Proceedings of the 2019 IEEE/SICE International Symposium on System Integration, SII 2019. Institute of Electrical and Electronics Engineers Inc. 2019. p. 679-682. 8700457. (Proceedings of the 2019 IEEE/SICE International Symposium on System Integration, SII 2019). https://doi.org/10.1109/SII.2019.8700457
Takahashi, Kotaro ; Hasegawa, Tadahiro ; Yuta, Shinrichi. / Flexible Electrostatic Adhesive Device and its Performance Evaluations. Proceedings of the 2019 IEEE/SICE International Symposium on System Integration, SII 2019. Institute of Electrical and Electronics Engineers Inc., 2019. pp. 679-682 (Proceedings of the 2019 IEEE/SICE International Symposium on System Integration, SII 2019).
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