Flip-Chip Bonding Process for CSTP Interconnected by Eutectic Solder Bumps,

N.Hirano N.Hirano, K.Doi K.Doi, E.Hosomi E.Hosomi, H.Tazawa H.Tazawa, K.Shibazaki K.Shibazaki, C.Takubo C.Takubo, T.Okada T.Okada, Y.Hiruta Y.Hiruta, T.Sudo T.Sudo, Toshio Sudo

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)15-17
JournalVLSI and Microsystem Packaging Workshop, Baveno Italy,
Publication statusPublished - 1996 Oct 15

Cite this

N.Hirano, N. H., K.Doi, K. D., E.Hosomi, E. H., H.Tazawa, H. T., K.Shibazaki, K. S., C.Takubo, C. T., ... Sudo, T. (1996). Flip-Chip Bonding Process for CSTP Interconnected by Eutectic Solder Bumps, VLSI and Microsystem Packaging Workshop, Baveno Italy, 15-17.

Flip-Chip Bonding Process for CSTP Interconnected by Eutectic Solder Bumps, / N.Hirano, N.Hirano; K.Doi, K.Doi; E.Hosomi, E.Hosomi; H.Tazawa, H.Tazawa; K.Shibazaki, K.Shibazaki; C.Takubo, C.Takubo; T.Okada, T.Okada; Y.Hiruta, Y.Hiruta; T.Sudo, T.Sudo; Sudo, Toshio.

In: VLSI and Microsystem Packaging Workshop, Baveno Italy, 15.10.1996, p. 15-17.

Research output: Contribution to journalArticle

N.Hirano, NH, K.Doi, KD, E.Hosomi, EH, H.Tazawa, HT, K.Shibazaki, KS, C.Takubo, CT, T.Okada, TO, Y.Hiruta, YH, T.Sudo, TS & Sudo, T 1996, 'Flip-Chip Bonding Process for CSTP Interconnected by Eutectic Solder Bumps,', VLSI and Microsystem Packaging Workshop, Baveno Italy, pp. 15-17.
N.Hirano NH, K.Doi KD, E.Hosomi EH, H.Tazawa HT, K.Shibazaki KS, C.Takubo CT et al. Flip-Chip Bonding Process for CSTP Interconnected by Eutectic Solder Bumps, VLSI and Microsystem Packaging Workshop, Baveno Italy,. 1996 Oct 15;15-17.
N.Hirano, N.Hirano ; K.Doi, K.Doi ; E.Hosomi, E.Hosomi ; H.Tazawa, H.Tazawa ; K.Shibazaki, K.Shibazaki ; C.Takubo, C.Takubo ; T.Okada, T.Okada ; Y.Hiruta, Y.Hiruta ; T.Sudo, T.Sudo ; Sudo, Toshio. / Flip-Chip Bonding Process for CSTP Interconnected by Eutectic Solder Bumps,. In: VLSI and Microsystem Packaging Workshop, Baveno Italy,. 1996 ; pp. 15-17.
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