Flip-Chip Bonding Process for CSTP Interconnected by Eutectic Solder Bumps,

N.Hirano N.Hirano, K.Doi K.Doi, E.Hosomi E.Hosomi, H.Tazawa H.Tazawa, K.Shibazaki K.Shibazaki, C.Takubo C.Takubo, T.Okada T.Okada, Y.Hiruta Y.Hiruta, T.Sudo T.Sudo, Toshio Sudo

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)15-17
JournalVLSI and Microsystem Packaging Workshop, Baveno Italy,
Publication statusPublished - 1996 Oct 15

Cite this

N.Hirano, N. H., K.Doi, K. D., E.Hosomi, E. H., H.Tazawa, H. T., K.Shibazaki, K. S., C.Takubo, C. T., T.Okada, T. O., Y.Hiruta, Y. H., T.Sudo, T. S., & Sudo, T. (1996). Flip-Chip Bonding Process for CSTP Interconnected by Eutectic Solder Bumps, VLSI and Microsystem Packaging Workshop, Baveno Italy, 15-17.