Folded U-shaped microwire technology for ultra-compact 3D MMICs

Kiyomitsu Onodera, Makoto Hirano, Ichihiko Toyoda, Masami Tokumitsu, Tsuneo Tokumitsu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

A novel microwire technology has been developed to fabricate 3-dimensional structures for use in ultra-compact GaAs MMICs. By folding metal into a U-shaped wall and burying it in a relatively thick polyimide insulator, vertical microwires can be made with both greatly reduced process complexity and process compatibility with multi-level interconnects. The proposed microwires are suitable for miniature transmission lines, miniature inductors, shielding walls, and multi-function passive elements like baluns and couplers.

Original languageEnglish
Title of host publicationIEEE MTT-S International Microwave Symposium Digest
PublisherIEEE
Pages1153-1156
Number of pages4
Volume2
Publication statusPublished - 1996
Externally publishedYes
EventProceedings of the 1996 IEEE MTT-S International Microwave Symposium Digest. Part 1 (of 3) - San Franscisco, CA, USA
Duration: 1996 Jun 171996 Jun 21

Other

OtherProceedings of the 1996 IEEE MTT-S International Microwave Symposium Digest. Part 1 (of 3)
CitySan Franscisco, CA, USA
Period96/6/1796/6/21

Fingerprint

Monolithic microwave integrated circuits
Polyimides
Shielding
Electric lines
inductors
Metals
polyimides
folding
compatibility
couplers
transmission lines
shielding
insulators
metals

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Condensed Matter Physics

Cite this

Onodera, K., Hirano, M., Toyoda, I., Tokumitsu, M., & Tokumitsu, T. (1996). Folded U-shaped microwire technology for ultra-compact 3D MMICs. In IEEE MTT-S International Microwave Symposium Digest (Vol. 2, pp. 1153-1156). IEEE.

Folded U-shaped microwire technology for ultra-compact 3D MMICs. / Onodera, Kiyomitsu; Hirano, Makoto; Toyoda, Ichihiko; Tokumitsu, Masami; Tokumitsu, Tsuneo.

IEEE MTT-S International Microwave Symposium Digest. Vol. 2 IEEE, 1996. p. 1153-1156.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Onodera, K, Hirano, M, Toyoda, I, Tokumitsu, M & Tokumitsu, T 1996, Folded U-shaped microwire technology for ultra-compact 3D MMICs. in IEEE MTT-S International Microwave Symposium Digest. vol. 2, IEEE, pp. 1153-1156, Proceedings of the 1996 IEEE MTT-S International Microwave Symposium Digest. Part 1 (of 3), San Franscisco, CA, USA, 96/6/17.
Onodera K, Hirano M, Toyoda I, Tokumitsu M, Tokumitsu T. Folded U-shaped microwire technology for ultra-compact 3D MMICs. In IEEE MTT-S International Microwave Symposium Digest. Vol. 2. IEEE. 1996. p. 1153-1156
Onodera, Kiyomitsu ; Hirano, Makoto ; Toyoda, Ichihiko ; Tokumitsu, Masami ; Tokumitsu, Tsuneo. / Folded U-shaped microwire technology for ultra-compact 3D MMICs. IEEE MTT-S International Microwave Symposium Digest. Vol. 2 IEEE, 1996. pp. 1153-1156
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