Folded U-shaped microwire technology for ultra-compact 3D MMICs

Kiyomitsu Onodera, Makoto Hirano, Ichihiko Toyoda, Masami Tokumitsu, Tsuneo Tokumitsu

    Research output: Contribution to journalConference article

    4 Citations (Scopus)

    Abstract

    A novel microwire technology has been developed to fabricate 3-dimensional structures for use in ultra-compact GaAs MMICs. By folding metal into a U-shaped wall and burying it in a relatively thick polyimide insulator, vertical microwires can be made with both greatly reduced process complexity and process compatibility with multi-level interconnects. The proposed microwires are suitable for miniature transmission lines, miniature inductors, shielding walls, and multi-function passive elements like baluns and couplers.

    Original languageEnglish
    Pages (from-to)1153-1156
    Number of pages4
    JournalIEEE MTT-S International Microwave Symposium Digest
    Volume2
    Publication statusPublished - 1996 Jan 1
    EventProceedings of the 1996 IEEE MTT-S International Microwave Symposium Digest. Part 1 (of 3) - San Franscisco, CA, USA
    Duration: 1996 Jun 171996 Jun 21

    ASJC Scopus subject areas

    • Radiation
    • Condensed Matter Physics
    • Electrical and Electronic Engineering

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  • Cite this

    Onodera, K., Hirano, M., Toyoda, I., Tokumitsu, M., & Tokumitsu, T. (1996). Folded U-shaped microwire technology for ultra-compact 3D MMICs. IEEE MTT-S International Microwave Symposium Digest, 2, 1153-1156.