Formation and gas barrier properties of silica thin films formed on heat resistant PET (Polyethylene Terephthalate) substrate by excimer light irradiation to polysilazane coatings

Tomoji Ohishi, Kousei Ichikawa

Research output: Contribution to journalArticle

Abstract

A solution of polysilazane (Perhydropolysilazane) was applied to a heat resistant PET substrate, and then irradiated with excimer light at 150 °C to form a gas barrier film. This film primarily consisted of a thin layer of SiO 2 , and had very high gas barrier properties, with a water vapor transmission rate of 0.02 g/m 2 ·day or less (40 °C/90% RH). This gas barrier film has good transparency, film adhesion, surface flatness, and flexibility, and since it has high heat resistance and good gas barrier performance, it is expected to have applications in films for flexible devices.

Original languageEnglish
Pages (from-to)143-146
Number of pages4
JournalMaterials Letters
Volume247
DOIs
Publication statusPublished - 2019 Jul 15

Fingerprint

Polyethylene Terephthalates
polyethylene terephthalate
excimers
Silicon Dioxide
Polyethylene terephthalates
Gases
Silica
Irradiation
silicon dioxide
coatings
Thin films
heat
Coatings
irradiation
Substrates
thin films
gases
Steam
flatness
thermal resistance

Keywords

  • Excimer light irradiation
  • Flexible electronics
  • Gas barrier characteristics
  • Heat-resistant PET film
  • Polysilazane

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

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abstract = "A solution of polysilazane (Perhydropolysilazane) was applied to a heat resistant PET substrate, and then irradiated with excimer light at 150 °C to form a gas barrier film. This film primarily consisted of a thin layer of SiO 2 , and had very high gas barrier properties, with a water vapor transmission rate of 0.02 g/m 2 ·day or less (40 °C/90{\%} RH). This gas barrier film has good transparency, film adhesion, surface flatness, and flexibility, and since it has high heat resistance and good gas barrier performance, it is expected to have applications in films for flexible devices.",
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AU - Ichikawa, Kousei

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N2 - A solution of polysilazane (Perhydropolysilazane) was applied to a heat resistant PET substrate, and then irradiated with excimer light at 150 °C to form a gas barrier film. This film primarily consisted of a thin layer of SiO 2 , and had very high gas barrier properties, with a water vapor transmission rate of 0.02 g/m 2 ·day or less (40 °C/90% RH). This gas barrier film has good transparency, film adhesion, surface flatness, and flexibility, and since it has high heat resistance and good gas barrier performance, it is expected to have applications in films for flexible devices.

AB - A solution of polysilazane (Perhydropolysilazane) was applied to a heat resistant PET substrate, and then irradiated with excimer light at 150 °C to form a gas barrier film. This film primarily consisted of a thin layer of SiO 2 , and had very high gas barrier properties, with a water vapor transmission rate of 0.02 g/m 2 ·day or less (40 °C/90% RH). This gas barrier film has good transparency, film adhesion, surface flatness, and flexibility, and since it has high heat resistance and good gas barrier performance, it is expected to have applications in films for flexible devices.

KW - Excimer light irradiation

KW - Flexible electronics

KW - Gas barrier characteristics

KW - Heat-resistant PET film

KW - Polysilazane

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