Fractographic observations on Sm-Ba-Cu-O bulk superconductors fractured by tensile tests

K. Katagiri, K. Kasaba, Y. Shoji, A. Chiba, M. Tomita, T. Miyamoto, Masato Murakami

Research output: Contribution to journalArticle

17 Citations (Scopus)

Abstract

The fracture surface morphology of top-seeded melt-grown SmBa2Cu3Ox bulk superconductors after tensile tests in 〈100〉 direction at room temperature was observed using SEM. There were voids with and without Ag particles of diameters ranging from 80 to <10 μm on the fracture surface of high density sample, while the size was 300 μm at the largest on the low density sample. Ag particles of 10 to 20 μm had the matching mate on the other side of the fracture surface. In the high density samples, the propagation of the crack was easily traced through the flow markings with steps on the fracture surface, while it was difficult to trace in low density samples.

Original languageEnglish
Pages (from-to)803-806
Number of pages4
JournalPhysica C: Superconductivity and its Applications
Volume357-360
Issue numberSUPPL. 2
DOIs
Publication statusPublished - 2001 Aug
Externally publishedYes

Fingerprint

tensile tests
Superconducting materials
marking
Surface morphology
voids
cracks
Cracks
Scanning electron microscopy
scanning electron microscopy
propagation
room temperature
Temperature

Keywords

  • Fractography
  • Sm-Ba-Cu-O bulk
  • Strength
  • Tensile test

ASJC Scopus subject areas

  • Condensed Matter Physics

Cite this

Fractographic observations on Sm-Ba-Cu-O bulk superconductors fractured by tensile tests. / Katagiri, K.; Kasaba, K.; Shoji, Y.; Chiba, A.; Tomita, M.; Miyamoto, T.; Murakami, Masato.

In: Physica C: Superconductivity and its Applications, Vol. 357-360, No. SUPPL. 2, 08.2001, p. 803-806.

Research output: Contribution to journalArticle

Katagiri, K. ; Kasaba, K. ; Shoji, Y. ; Chiba, A. ; Tomita, M. ; Miyamoto, T. ; Murakami, Masato. / Fractographic observations on Sm-Ba-Cu-O bulk superconductors fractured by tensile tests. In: Physica C: Superconductivity and its Applications. 2001 ; Vol. 357-360, No. SUPPL. 2. pp. 803-806.
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