Fundamental circuit technology for three-dimensional MMICs

Ichihiko Toyoda, Makoto Hirano, Kenjiro Nishikawa, Kenji Kamogawa

Research output: Contribution to journalArticle

Abstract

A novel three-dimensional MMIC technology is developed to make highly integrated multifunctional MMICs. This paper describes its structure and features and various new transmission lines using the structure. Novel passive circuits, such as a quadrature hybrid, an in-phase power divider, and a balun, are demonstrated to highlight the advantages of the 3-D MMIC technology. In the last section, the design concepts of a low-noise amplifier, a variable gain amplifier, and an image-rejection mixer are also described. The highly integrated multifunctional MMICs and masterslice MMICs described in this special issue can be made using 3-D MMIC technology and these fundamental circuits.

Original languageEnglish
Pages (from-to)1269-1275
Number of pages7
JournalNTT R and D
Volume45
Issue number12
Publication statusPublished - 1996
Externally publishedYes

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Monolithic microwave integrated circuits
Networks (circuits)
Passive networks
Mixer circuits
Low noise amplifiers
Electric lines

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Toyoda, I., Hirano, M., Nishikawa, K., & Kamogawa, K. (1996). Fundamental circuit technology for three-dimensional MMICs. NTT R and D, 45(12), 1269-1275.

Fundamental circuit technology for three-dimensional MMICs. / Toyoda, Ichihiko; Hirano, Makoto; Nishikawa, Kenjiro; Kamogawa, Kenji.

In: NTT R and D, Vol. 45, No. 12, 1996, p. 1269-1275.

Research output: Contribution to journalArticle

Toyoda, I, Hirano, M, Nishikawa, K & Kamogawa, K 1996, 'Fundamental circuit technology for three-dimensional MMICs', NTT R and D, vol. 45, no. 12, pp. 1269-1275.
Toyoda I, Hirano M, Nishikawa K, Kamogawa K. Fundamental circuit technology for three-dimensional MMICs. NTT R and D. 1996;45(12):1269-1275.
Toyoda, Ichihiko ; Hirano, Makoto ; Nishikawa, Kenjiro ; Kamogawa, Kenji. / Fundamental circuit technology for three-dimensional MMICs. In: NTT R and D. 1996 ; Vol. 45, No. 12. pp. 1269-1275.
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