Fundamental study on electrically-induced bubble catalytic plating technology

Yudai Fukuyama, Keita Ichikawa, Shingo Maeda, Yoko Yamanishi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We have succeeded in metallization by embedding metal on the flexible polymer substrate such as PDMS. Novel points of this technology are shown as follows. 1. It eliminates complicated pretreatment processes on the substrate surface before plating, so it is less expensive than electroless plating. 2. Plating resolution in micro-meter order can be achieved with low cost. 3. It is possible to perform local and precise metallization on a wide range of materials without using specialized techniques such as photolithography.

Original languageEnglish
Title of host publicationMHS 2017 - 28th 2017 International Symposium on Micro-NanoMechatronics and Human Science
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1-3
Number of pages3
Volume2018-January
ISBN (Electronic)9781538633144
DOIs
Publication statusPublished - 2018 Feb 28
Event28th International Symposium on Micro-NanoMechatronics and Human Science, MHS 2017 - Nagoya, Japan
Duration: 2017 Dec 32017 Dec 6

Other

Other28th International Symposium on Micro-NanoMechatronics and Human Science, MHS 2017
CountryJapan
CityNagoya
Period17/12/317/12/6

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ASJC Scopus subject areas

  • Biotechnology
  • Biomedical Engineering
  • Electrical and Electronic Engineering
  • Mechanical Engineering

Cite this

Fukuyama, Y., Ichikawa, K., Maeda, S., & Yamanishi, Y. (2018). Fundamental study on electrically-induced bubble catalytic plating technology. In MHS 2017 - 28th 2017 International Symposium on Micro-NanoMechatronics and Human Science (Vol. 2018-January, pp. 1-3). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/MHS.2017.8305166