| Original language | English |
|---|---|
| Pages (from-to) | 357-366 |
| Journal | International Conference on Electronic Materials, Proceedings Volume |
| Publication status | Published - 1995 Jan 1 |
Cite this
Future Trend for Interlayer Dielectric Films and Their Formation Technomogies in VLSI Multilevel Interconnections. / Homma, T.
In: International Conference on Electronic Materials, Proceedings Volume, 01.01.1995, p. 357-366.Research output: Contribution to journal › Article
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author = "T. Homma",
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EP - 366
JO - International Conference on Electronic Materials, Proceedings Volume
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