Future Trend for Interlayer Dielectric Films and Their Formation Technomogies in VLSI Multilevel Interconnections

Research output: Contribution to journalArticle

5 Citations (Scopus)
Original languageEnglish
Pages (from-to)357-366
JournalInternational Conference on Electronic Materials, Proceedings Volume
Publication statusPublished - 1995 Jan 1

Cite this

@article{7bdb00a71967442a9ad80d4c3df7c236,
title = "Future Trend for Interlayer Dielectric Films and Their Formation Technomogies in VLSI Multilevel Interconnections",
author = "T. Homma",
year = "1995",
month = "1",
day = "1",
language = "English",
pages = "357--366",
journal = "International Conference on Electronic Materials, Proceedings Volume",

}

TY - JOUR

T1 - Future Trend for Interlayer Dielectric Films and Their Formation Technomogies in VLSI Multilevel Interconnections

AU - Homma, T.

PY - 1995/1/1

Y1 - 1995/1/1

M3 - Article

SP - 357

EP - 366

JO - International Conference on Electronic Materials, Proceedings Volume

JF - International Conference on Electronic Materials, Proceedings Volume

ER -