Original language | English |
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Pages (from-to) | 357-366 |
Journal | International Conference on Electronic Materials, Proceedings Volume |
Publication status | Published - 1995 Jan 1 |
Future Trend for Interlayer Dielectric Films and Their Formation Technomogies in VLSI Multilevel Interconnections
Research output: Contribution to journal › Article › peer-review
5
Citations
(Scopus)