Future Trend for Interlayer Dielectric Films and Their Formation Technomogies in VLSI Multilevel Interconnections

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	357-366
Journal	International Conference on Electronic Materials, Proceedings Volume
Publication status	Published - 1995 Jan 1

Cite this

@article{7bdb00a71967442a9ad80d4c3df7c236,

title = "Future Trend for Interlayer Dielectric Films and Their Formation Technomogies in VLSI Multilevel Interconnections",

author = "T. Homma",

year = "1995",

month = jan,

day = "1",

language = "English",

pages = "357--366",

journal = "International Conference on Electronic Materials, Proceedings Volume",

}