Future Trend for Interlayer Dielectric Films and Their Formation Technologies in VLSI Multilevel Interconnections

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)117
JournalInternational Conference on Electronic Materials (ICEM) Abstracts(Symposium E2.5)
Publication statusPublished - 1994 Dec 19

Cite this

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title = "Future Trend for Interlayer Dielectric Films and Their Formation Technologies in VLSI Multilevel Interconnections",
author = "T. Homma",
year = "1994",
month = "12",
day = "19",
language = "English",
pages = "117",
journal = "International Conference on Electronic Materials (ICEM) Abstracts(Symposium E2.5)",

}

TY - JOUR

T1 - Future Trend for Interlayer Dielectric Films and Their Formation Technologies in VLSI Multilevel Interconnections

AU - Homma, T.

PY - 1994/12/19

Y1 - 1994/12/19

M3 - Article

SP - 117

JO - International Conference on Electronic Materials (ICEM) Abstracts(Symposium E2.5)

JF - International Conference on Electronic Materials (ICEM) Abstracts(Symposium E2.5)

ER -