Future Trends for Interlayer Dielectric Films and Their Formation Technologies in VLSI Multilevel Interconnections

Research output: Contribution to journalArticle

7 Citations (Scopus)
Original languageEnglish
Pages (from-to)234-239
JournalJournal of Materials Chemistry and Physics
Volume41
Publication statusPublished - 1995 Apr 1

Cite this

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title = "Future Trends for Interlayer Dielectric Films and Their Formation Technologies in VLSI Multilevel Interconnections",
author = "T. Homma",
year = "1995",
month = "4",
day = "1",
language = "English",
volume = "41",
pages = "234--239",
journal = "Journal of Materials Chemistry and Physics",

}

TY - JOUR

T1 - Future Trends for Interlayer Dielectric Films and Their Formation Technologies in VLSI Multilevel Interconnections

AU - Homma, T.

PY - 1995/4/1

Y1 - 1995/4/1

M3 - Article

VL - 41

SP - 234

EP - 239

JO - Journal of Materials Chemistry and Physics

JF - Journal of Materials Chemistry and Physics

ER -