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Future trends for interlayer dielectric films and their formation technologies in ULSI multilevel interconnections
Tetsuya Homma
Research output
:
Contribution to journal
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Review article
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peer-review
8
Citations (Scopus)
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Chemical Compounds
Dielectric Film
98%
Deposition Technique
73%
Liquid Film
32%
Ambient Reaction Temperature
30%
Dielectric Constant
24%
Chemical Vapour Deposition
24%
Liquid
22%
Gas
14%
Ozone
13%
Surface
12%
Plasma
8%
Aqueous Solution
7%
Purity
6%
Acid
4%
Physics & Astronomy
interlayers
61%
trends
50%
liquid phases
24%
room temperature
21%
vapor deposition
14%
permittivity
13%
requirements
13%
wiring
12%
pretreatment
10%
ozone
10%
gases
9%
aqueous solutions
8%
acids
8%
vapors
7%
glass
5%
water
5%
temperature
2%
Engineering & Materials Science
Dielectric films
100%
Chemical vapor deposition
22%
Permittivity
19%
Liquids
19%
Temperature
19%
Ozone
12%
Gases
11%
Electric wiring
10%
Plasmas
8%
Acids
8%
Vapors
8%
Glass
7%
Water
5%