Glass cutting by femtosecond pulsed irradiation

Egidijus Vanagas, Jouji Kawai, Dmitrii Tuzhilin, Igor Kudryashov, Atsushi Mizuyama, Kazutaka G. Nakamura, Ken Ichi Kondo, Shin Ya Koshihara, Masaki Takesada, Kazunari Matsuda, Saulius Juodkazis, Vygandas Jarutls, Shigeki Matsuo, Hiroaki Misawa

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36 Citations (Scopus)

Abstract

We report on quartz and glass cutting by a lateral scanning of femtosecond pulses (150 fs at 1 kHz repetition rate) of 800 nm wavelength at room and low pressure (5 Torr) air ambience. Pulses were focused by a low numerical aperture (NA≤0.1) objective lens. Optimization of fabrication conditions: pulse energy and scanning speed were carried out to achieve large-scale (millimeter-to- centimeter) cutting free of microcracks of submicron dimensions along the edges and walls of the cut. Cutting through out the samples of 0.1-0.5 mm thickness was successfully achieved without apparent heat affected zone. At low air pressure (5 Torr) ambience, redeposition of ablated material was considerably reduced. It is demonstrated that the damage on the rear surface was induced by the stress waves, which originated from the plasma ablation pressure pulse. The mechanism of femtosecond-laser cutting of transparent materials at high irradiance and the influence of stress waves generated by plasma plume are discussed.

Original languageEnglish
Pages (from-to)358-363
Number of pages6
JournalJournal of Microlithography, Microfabrication and Microsystems
Volume3
Issue number2
DOIs
Publication statusPublished - 2004 Apr 1

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Keywords

  • Ablation
  • Femtosecond laser microfabrication
  • Glass and quartz dicing

ASJC Scopus subject areas

  • Atomic and Molecular Physics, and Optics
  • Electrical and Electronic Engineering

Cite this

Vanagas, E., Kawai, J., Tuzhilin, D., Kudryashov, I., Mizuyama, A., Nakamura, K. G., Kondo, K. I., Koshihara, S. Y., Takesada, M., Matsuda, K., Juodkazis, S., Jarutls, V., Matsuo, S., & Misawa, H. (2004). Glass cutting by femtosecond pulsed irradiation. Journal of Microlithography, Microfabrication and Microsystems, 3(2), 358-363. https://doi.org/10.1117/1.1668274