Grain growth of electroplated copper film by alternative annealing methods

Kazuyoshi Ueno, Kouichiro Shimotani, Yuji Shimada, Shigeru Yomogida, Takato Takeshita, Akiko Hashimoto, Takashi Yata

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

Alternative annealing methods using current stress or supercritical fluid (SCF) are investigated for electroplated copper (Cu) films. The current stress method promotes grain growth at room temperature, mostly through the Joule heating effect. The grain size resulting from the SCF annealing method was more uniform; therefore, it is a potentially better method for improvement of the microstructure in electroplated Cu films.

Original languageEnglish
Title of host publicationAdvanced Metallization Conference 2008, AMC 2008
Pages283-287
Number of pages5
Publication statusPublished - 2009 Oct 19
EventAdvanced Metallization Conference 2008, AMC 2008 - San Diego, CA, United States
Duration: 2008 Sep 232008 Sep 25

Publication series

NameAdvanced Metallization Conference (AMC)
ISSN (Print)1540-1766

Conference

ConferenceAdvanced Metallization Conference 2008, AMC 2008
CountryUnited States
CitySan Diego, CA
Period08/9/2308/9/25

ASJC Scopus subject areas

  • Materials Science(all)
  • Industrial and Manufacturing Engineering

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  • Cite this

    Ueno, K., Shimotani, K., Shimada, Y., Yomogida, S., Takeshita, T., Hashimoto, A., & Yata, T. (2009). Grain growth of electroplated copper film by alternative annealing methods. In Advanced Metallization Conference 2008, AMC 2008 (pp. 283-287). (Advanced Metallization Conference (AMC)).