Grain growth of electroplated copper film by alternative annealing methods

Kazuyoshi Ueno, Kouichiro Shimotani, Yuji Shimada, Shigeru Yomogida, Takato Takeshita, Akiko Hashimoto, Takashi Yata

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

Alternative annealing methods using current stress or supercritical fluid (SCF) are investigated for electroplated copper (Cu) films. The current stress method promotes grain growth at room temperature, mostly through the Joule heating effect. The grain size resulting from the SCF annealing method was more uniform; therefore, it is a potentially better method for improvement of the microstructure in electroplated Cu films.

Original languageEnglish
Title of host publicationAdvanced Metallization Conference (AMC)
Pages283-287
Number of pages5
Publication statusPublished - 2009
EventAdvanced Metallization Conference 2008, AMC 2008 - San Diego, CA
Duration: 2008 Sep 232008 Sep 25

Other

OtherAdvanced Metallization Conference 2008, AMC 2008
CitySan Diego, CA
Period08/9/2308/9/25

Fingerprint

Supercritical fluids
Grain growth
Copper
Annealing
Joule heating
Microstructure
Temperature

ASJC Scopus subject areas

  • Materials Science(all)
  • Industrial and Manufacturing Engineering

Cite this

Ueno, K., Shimotani, K., Shimada, Y., Yomogida, S., Takeshita, T., Hashimoto, A., & Yata, T. (2009). Grain growth of electroplated copper film by alternative annealing methods. In Advanced Metallization Conference (AMC) (pp. 283-287)

Grain growth of electroplated copper film by alternative annealing methods. / Ueno, Kazuyoshi; Shimotani, Kouichiro; Shimada, Yuji; Yomogida, Shigeru; Takeshita, Takato; Hashimoto, Akiko; Yata, Takashi.

Advanced Metallization Conference (AMC). 2009. p. 283-287.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Ueno, K, Shimotani, K, Shimada, Y, Yomogida, S, Takeshita, T, Hashimoto, A & Yata, T 2009, Grain growth of electroplated copper film by alternative annealing methods. in Advanced Metallization Conference (AMC). pp. 283-287, Advanced Metallization Conference 2008, AMC 2008, San Diego, CA, 08/9/23.
Ueno K, Shimotani K, Shimada Y, Yomogida S, Takeshita T, Hashimoto A et al. Grain growth of electroplated copper film by alternative annealing methods. In Advanced Metallization Conference (AMC). 2009. p. 283-287
Ueno, Kazuyoshi ; Shimotani, Kouichiro ; Shimada, Yuji ; Yomogida, Shigeru ; Takeshita, Takato ; Hashimoto, Akiko ; Yata, Takashi. / Grain growth of electroplated copper film by alternative annealing methods. Advanced Metallization Conference (AMC). 2009. pp. 283-287
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