Granular modeling approach to electro-packaging materials

Tatsuhiko Aizawa, Takashi Iwai, Junji Kihara

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

The particulate material to be used for electro-packaging of LSI-chip is a compound of polymer matrix and silica particles. In its materials design, a volume fraction of silica must be designed to reduce the difference of thermal expansion coefficients between the compound and the semiconductive device. Since the loading ratio of silica particles in the polymer matrix reaches to 60 vol.% in actual situation, the viscous flow of the compound can be identified as a non-Newtonian fluid; since nonlinear viscosity changes itself even in local with the process time, various defects or porosities have to be left in the final product. In other words, new materials processing design is necessary to rationally determine the geometry and dimensions of a die-set system and to adequately optimize the process parameters. In the present paper, a granular modeling is proposed to describe the rheological behavior of this high-loaded particulate compound. Use of this modeling enables us to make direct process simulations for investigation of the formation of defects and understanding of mechanism to be free from defects. Simulated results indicate a rational possibility for the present granular modeling to be used for the related materials processing design to the particulate electro-packaging materials.

Original languageEnglish
Pages (from-to)83-91
Number of pages9
JournalMechanics of Materials
Volume28
Issue number1-4
Publication statusPublished - 1998 Jul
Externally publishedYes

Fingerprint

Packaging materials
packaging
particulates
Silicon Dioxide
silicon dioxide
Silica
defects
Polymer matrix
Defects
large scale integration
polymers
viscous flow
matrices
thermal expansion
Viscous flow
Processing
chips
viscosity
Thermal expansion
porosity

Keywords

  • Defect formation
  • Electro-packaging
  • Granular model
  • Rheological behavior
  • Silica particle
  • Thermoset polymer

ASJC Scopus subject areas

  • Mechanics of Materials

Cite this

Aizawa, T., Iwai, T., & Kihara, J. (1998). Granular modeling approach to electro-packaging materials. Mechanics of Materials, 28(1-4), 83-91.

Granular modeling approach to electro-packaging materials. / Aizawa, Tatsuhiko; Iwai, Takashi; Kihara, Junji.

In: Mechanics of Materials, Vol. 28, No. 1-4, 07.1998, p. 83-91.

Research output: Contribution to journalArticle

Aizawa, T, Iwai, T & Kihara, J 1998, 'Granular modeling approach to electro-packaging materials', Mechanics of Materials, vol. 28, no. 1-4, pp. 83-91.
Aizawa T, Iwai T, Kihara J. Granular modeling approach to electro-packaging materials. Mechanics of Materials. 1998 Jul;28(1-4):83-91.
Aizawa, Tatsuhiko ; Iwai, Takashi ; Kihara, Junji. / Granular modeling approach to electro-packaging materials. In: Mechanics of Materials. 1998 ; Vol. 28, No. 1-4. pp. 83-91.
@article{3ff0ac2415274c488544be636265e958,
title = "Granular modeling approach to electro-packaging materials",
abstract = "The particulate material to be used for electro-packaging of LSI-chip is a compound of polymer matrix and silica particles. In its materials design, a volume fraction of silica must be designed to reduce the difference of thermal expansion coefficients between the compound and the semiconductive device. Since the loading ratio of silica particles in the polymer matrix reaches to 60 vol.{\%} in actual situation, the viscous flow of the compound can be identified as a non-Newtonian fluid; since nonlinear viscosity changes itself even in local with the process time, various defects or porosities have to be left in the final product. In other words, new materials processing design is necessary to rationally determine the geometry and dimensions of a die-set system and to adequately optimize the process parameters. In the present paper, a granular modeling is proposed to describe the rheological behavior of this high-loaded particulate compound. Use of this modeling enables us to make direct process simulations for investigation of the formation of defects and understanding of mechanism to be free from defects. Simulated results indicate a rational possibility for the present granular modeling to be used for the related materials processing design to the particulate electro-packaging materials.",
keywords = "Defect formation, Electro-packaging, Granular model, Rheological behavior, Silica particle, Thermoset polymer",
author = "Tatsuhiko Aizawa and Takashi Iwai and Junji Kihara",
year = "1998",
month = "7",
language = "English",
volume = "28",
pages = "83--91",
journal = "Mechanics of Materials",
issn = "0167-6636",
publisher = "Elsevier",
number = "1-4",

}

TY - JOUR

T1 - Granular modeling approach to electro-packaging materials

AU - Aizawa, Tatsuhiko

AU - Iwai, Takashi

AU - Kihara, Junji

PY - 1998/7

Y1 - 1998/7

N2 - The particulate material to be used for electro-packaging of LSI-chip is a compound of polymer matrix and silica particles. In its materials design, a volume fraction of silica must be designed to reduce the difference of thermal expansion coefficients between the compound and the semiconductive device. Since the loading ratio of silica particles in the polymer matrix reaches to 60 vol.% in actual situation, the viscous flow of the compound can be identified as a non-Newtonian fluid; since nonlinear viscosity changes itself even in local with the process time, various defects or porosities have to be left in the final product. In other words, new materials processing design is necessary to rationally determine the geometry and dimensions of a die-set system and to adequately optimize the process parameters. In the present paper, a granular modeling is proposed to describe the rheological behavior of this high-loaded particulate compound. Use of this modeling enables us to make direct process simulations for investigation of the formation of defects and understanding of mechanism to be free from defects. Simulated results indicate a rational possibility for the present granular modeling to be used for the related materials processing design to the particulate electro-packaging materials.

AB - The particulate material to be used for electro-packaging of LSI-chip is a compound of polymer matrix and silica particles. In its materials design, a volume fraction of silica must be designed to reduce the difference of thermal expansion coefficients between the compound and the semiconductive device. Since the loading ratio of silica particles in the polymer matrix reaches to 60 vol.% in actual situation, the viscous flow of the compound can be identified as a non-Newtonian fluid; since nonlinear viscosity changes itself even in local with the process time, various defects or porosities have to be left in the final product. In other words, new materials processing design is necessary to rationally determine the geometry and dimensions of a die-set system and to adequately optimize the process parameters. In the present paper, a granular modeling is proposed to describe the rheological behavior of this high-loaded particulate compound. Use of this modeling enables us to make direct process simulations for investigation of the formation of defects and understanding of mechanism to be free from defects. Simulated results indicate a rational possibility for the present granular modeling to be used for the related materials processing design to the particulate electro-packaging materials.

KW - Defect formation

KW - Electro-packaging

KW - Granular model

KW - Rheological behavior

KW - Silica particle

KW - Thermoset polymer

UR - http://www.scopus.com/inward/record.url?scp=0032066096&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0032066096&partnerID=8YFLogxK

M3 - Article

VL - 28

SP - 83

EP - 91

JO - Mechanics of Materials

JF - Mechanics of Materials

SN - 0167-6636

IS - 1-4

ER -