Granular Modeling Approach to Electro-Packaging Materials.

T. Aizawa, T. Iwai, J. Kihara

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)83-91
JournalJ. Mechanics of Materials.
Volume(1998)
Publication statusPublished - 1800

Cite this

Aizawa, T., Iwai, T., & Kihara, J. (1800). Granular Modeling Approach to Electro-Packaging Materials. J. Mechanics of Materials., (1998), 83-91.

Granular Modeling Approach to Electro-Packaging Materials. / Aizawa, T.; Iwai, T.; Kihara, J.

In: J. Mechanics of Materials., Vol. (1998), 1800, p. 83-91.

Research output: Contribution to journalArticle

Aizawa, T, Iwai, T & Kihara, J 1800, 'Granular Modeling Approach to Electro-Packaging Materials.', J. Mechanics of Materials., vol. (1998), pp. 83-91.
Aizawa, T. ; Iwai, T. ; Kihara, J. / Granular Modeling Approach to Electro-Packaging Materials. In: J. Mechanics of Materials. 1800 ; Vol. (1998). pp. 83-91.
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