High-Density Multichip Module by Chip-On-Wafer Technology,

S.Kimijima S.Kimijima, T.Miyagi T.Miyagi, T.Sudo T.Sudo, O.Shimada O.Shimada, Toshio Sudo

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)314-319
JournalISHM, Seattle,
Publication statusPublished - 1998 Oct 25

Cite this

S.Kimijima, S. K., T.Miyagi, T. M., T.Sudo, T. S., O.Shimada, O. S., & Sudo, T. (1998). High-Density Multichip Module by Chip-On-Wafer Technology, ISHM, Seattle, 314-319.

High-Density Multichip Module by Chip-On-Wafer Technology, / S.Kimijima, S.Kimijima; T.Miyagi, T.Miyagi; T.Sudo, T.Sudo; O.Shimada, O.Shimada; Sudo, Toshio.

In: ISHM, Seattle, 25.10.1998, p. 314-319.

Research output: Contribution to journalArticle

S.Kimijima, SK, T.Miyagi, TM, T.Sudo, TS, O.Shimada, OS & Sudo, T 1998, 'High-Density Multichip Module by Chip-On-Wafer Technology,', ISHM, Seattle, pp. 314-319.
S.Kimijima SK, T.Miyagi TM, T.Sudo TS, O.Shimada OS, Sudo T. High-Density Multichip Module by Chip-On-Wafer Technology, ISHM, Seattle,. 1998 Oct 25;314-319.
S.Kimijima, S.Kimijima ; T.Miyagi, T.Miyagi ; T.Sudo, T.Sudo ; O.Shimada, O.Shimada ; Sudo, Toshio. / High-Density Multichip Module by Chip-On-Wafer Technology,. In: ISHM, Seattle,. 1998 ; pp. 314-319.
@article{3f82403da0774f1e96e15c99c6cb673c,
title = "High-Density Multichip Module by Chip-On-Wafer Technology,",
author = "S.Kimijima S.Kimijima and T.Miyagi T.Miyagi and T.Sudo T.Sudo and O.Shimada O.Shimada and Toshio Sudo",
year = "1998",
month = "10",
day = "25",
language = "English",
pages = "314--319",
journal = "ISHM, Seattle,",

}

TY - JOUR

T1 - High-Density Multichip Module by Chip-On-Wafer Technology,

AU - S.Kimijima, S.Kimijima

AU - T.Miyagi, T.Miyagi

AU - T.Sudo, T.Sudo

AU - O.Shimada, O.Shimada

AU - Sudo, Toshio

PY - 1998/10/25

Y1 - 1998/10/25

M3 - Article

SP - 314

EP - 319

JO - ISHM, Seattle,

JF - ISHM, Seattle,

ER -