High-Density Multichip Module by Chip-On-Wafer Technology,

S.Kimijima S.Kimijima, T.Miyagi T.Miyagi, T.Sudo T.Sudo, O.Shimada O.Shimada, Toshio Sudo

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)314-319
JournalISHM, Seattle,
Publication statusPublished - 1998 Oct 25

Cite this

S.Kimijima, S. K., T.Miyagi, T. M., T.Sudo, T. S., O.Shimada, O. S., & Sudo, T. (1998). High-Density Multichip Module by Chip-On-Wafer Technology, ISHM, Seattle, 314-319.