HIGH SPEED AND RESOLUTION IMAGE SENSING HYBRID PACKAGE.

Toshio Sudo, Kohei Suzuki, Tamio Saito

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

A color image sensing hybrid module with high speed and high resolution has been developed. This module can be used for a facsimile set or an image processor or a copy apparatus as a read-out sensor. A multi-chip CCD image sensor is introduced. Eight on chip color filter CCD chips are staggered in two rows one after the other on a multilayer substrate. These chips are covered by a selectively transparent glass lid for shadowing unwanted areas. Consequently, the developed sensor can read an 8 1/2'' wide color manuscript with 12 dots/mm resolution and 2 msec/line reading speed.

Original languageEnglish
Pages (from-to)547-550
Number of pages4
JournalInternational Journal of Microcircuits and Electronic Packaging
Volume6
Issue number1
Publication statusPublished - 1983

Fingerprint

Image resolution
Color
Charge coupled devices
Facsimile
Sensors
Image sensors
Multilayers
Glass
Substrates

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

HIGH SPEED AND RESOLUTION IMAGE SENSING HYBRID PACKAGE. / Sudo, Toshio; Suzuki, Kohei; Saito, Tamio.

In: International Journal of Microcircuits and Electronic Packaging, Vol. 6, No. 1, 1983, p. 547-550.

Research output: Contribution to journalArticle

Sudo, Toshio ; Suzuki, Kohei ; Saito, Tamio. / HIGH SPEED AND RESOLUTION IMAGE SENSING HYBRID PACKAGE. In: International Journal of Microcircuits and Electronic Packaging. 1983 ; Vol. 6, No. 1. pp. 547-550.
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