High Temperature Fatigue Crack Propagation Characteristics of Pressureless Sintered Silver Nanoparticles

Koji Osaki, Yoshiharu Kariya, Noritsuka Mizumura, Koji Sasaki

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The exponent of the fatigue crack propagation law of the sintered Ag was decreased with an increase in temperature. The decreasing the exponent was related to the viscous behavior of the grain boundaries. However, the exponent increased again at 473K that was associated by a decrease in CTOD due to progression of sintering.

Original languageEnglish
Title of host publicationProceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019
PublisherInstitute of Electrical and Electronics Engineers Inc.
Number of pages1
ISBN (Electronic)9784904743072
DOIs
Publication statusPublished - 2019 May 1
Event6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019 - Kanazawa, Ishikawa, Japan
Duration: 2019 May 212019 May 25

Publication series

NameProceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019

Conference

Conference6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019
CountryJapan
CityKanazawa, Ishikawa
Period19/5/2119/5/25

Fingerprint

Fatigue crack propagation
Silver
Grain boundaries
Sintering
Nanoparticles
Temperature

ASJC Scopus subject areas

  • Process Chemistry and Technology
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Osaki, K., Kariya, Y., Mizumura, N., & Sasaki, K. (2019). High Temperature Fatigue Crack Propagation Characteristics of Pressureless Sintered Silver Nanoparticles. In Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019 [8735315] (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.23919/LTB-3D.2019.8735315

High Temperature Fatigue Crack Propagation Characteristics of Pressureless Sintered Silver Nanoparticles. / Osaki, Koji; Kariya, Yoshiharu; Mizumura, Noritsuka; Sasaki, Koji.

Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 2019. 8735315 (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Osaki, K, Kariya, Y, Mizumura, N & Sasaki, K 2019, High Temperature Fatigue Crack Propagation Characteristics of Pressureless Sintered Silver Nanoparticles. in Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019., 8735315, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019, Institute of Electrical and Electronics Engineers Inc., 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019, Kanazawa, Ishikawa, Japan, 19/5/21. https://doi.org/10.23919/LTB-3D.2019.8735315
Osaki K, Kariya Y, Mizumura N, Sasaki K. High Temperature Fatigue Crack Propagation Characteristics of Pressureless Sintered Silver Nanoparticles. In Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc. 2019. 8735315. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019). https://doi.org/10.23919/LTB-3D.2019.8735315
Osaki, Koji ; Kariya, Yoshiharu ; Mizumura, Noritsuka ; Sasaki, Koji. / High Temperature Fatigue Crack Propagation Characteristics of Pressureless Sintered Silver Nanoparticles. Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 2019. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).
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