Highly-Integrated 3-D MMIC Technology Being Applied to Novel Masterslice GaAs-and Si-MMIC's

Tsuneo Tokumitsu, Makoto Hirano, Kimiyoshi Yamazaki, Chikara Yamaguchi, Masayoshi Aikawa

    Research output: Contribution to journalArticle

    9 Citations (Scopus)
    Original languageEnglish
    Pages (from-to)151-154
    JournalIEEE GaAs IC Symp.,Tech.Dig.
    Publication statusPublished - 1996 Apr 1

    Cite this

    Tokumitsu, T., Hirano, M., Yamazaki, K., Yamaguchi, C., & Aikawa, M. (1996). Highly-Integrated 3-D MMIC Technology Being Applied to Novel Masterslice GaAs-and Si-MMIC's. IEEE GaAs IC Symp.,Tech.Dig., 151-154.

    Highly-Integrated 3-D MMIC Technology Being Applied to Novel Masterslice GaAs-and Si-MMIC's. / Tokumitsu, Tsuneo; Hirano, Makoto; Yamazaki, Kimiyoshi; Yamaguchi, Chikara; Aikawa, Masayoshi.

    In: IEEE GaAs IC Symp.,Tech.Dig., 01.04.1996, p. 151-154.

    Research output: Contribution to journalArticle

    Tokumitsu, T, Hirano, M, Yamazaki, K, Yamaguchi, C & Aikawa, M 1996, 'Highly-Integrated 3-D MMIC Technology Being Applied to Novel Masterslice GaAs-and Si-MMIC's', IEEE GaAs IC Symp.,Tech.Dig., pp. 151-154.
    Tokumitsu T, Hirano M, Yamazaki K, Yamaguchi C, Aikawa M. Highly-Integrated 3-D MMIC Technology Being Applied to Novel Masterslice GaAs-and Si-MMIC's. IEEE GaAs IC Symp.,Tech.Dig. 1996 Apr 1;151-154.
    Tokumitsu, Tsuneo ; Hirano, Makoto ; Yamazaki, Kimiyoshi ; Yamaguchi, Chikara ; Aikawa, Masayoshi. / Highly-Integrated 3-D MMIC Technology Being Applied to Novel Masterslice GaAs-and Si-MMIC's. In: IEEE GaAs IC Symp.,Tech.Dig. 1996 ; pp. 151-154.
    @article{62d8ff80c40c453884e35a165ed1308e,
    title = "Highly-Integrated 3-D MMIC Technology Being Applied to Novel Masterslice GaAs-and Si-MMIC's",
    author = "Tsuneo Tokumitsu and Makoto Hirano and Kimiyoshi Yamazaki and Chikara Yamaguchi and Masayoshi Aikawa",
    year = "1996",
    month = "4",
    day = "1",
    language = "English",
    pages = "151--154",
    journal = "IEEE GaAs IC Symp.,Tech.Dig.",

    }

    TY - JOUR

    T1 - Highly-Integrated 3-D MMIC Technology Being Applied to Novel Masterslice GaAs-and Si-MMIC's

    AU - Tokumitsu, Tsuneo

    AU - Hirano, Makoto

    AU - Yamazaki, Kimiyoshi

    AU - Yamaguchi, Chikara

    AU - Aikawa, Masayoshi

    PY - 1996/4/1

    Y1 - 1996/4/1

    M3 - Article

    SP - 151

    EP - 154

    JO - IEEE GaAs IC Symp.,Tech.Dig.

    JF - IEEE GaAs IC Symp.,Tech.Dig.

    ER -