Highly-integrated three-dimensional MMIC 20-GHz single chip receiver

Kenjiro Nishikawa, Kenji Kamogawa, Tsuneo Tokumitsu, Masayoshi Aikawa, Makoto Hirano, Suehiro Sugitani

Research output: Chapter in Book/Report/Conference proceedingConference contribution

8 Citations (Scopus)

Abstract

A highly-integrated, three-dimensional 20-GHz band single chip receiver employing four thin polyimide films on a GaAs wafer is presented. The fabricated receiver implements three RF variable-gain amplifiers, an image rejectlon mixer, two LO amplifiers, and a voltage controlled oscillatorin an areaof only 1.78 mm × 1.78 mm. The performances of the demonstrated receiver are a 17dB gain and an integration level about three times as high as those of conventional receiver MMICs. The design methodologies used to achieve compact RF circuits on a single chip are also described.

Original languageEnglish
Title of host publication1996 26th European Microwave Conference, EuMC 1996
PublisherIEEE Computer Society
Pages199-203
Number of pages5
Volume1
DOIs
Publication statusPublished - 1996
Externally publishedYes
Event1996 26th European Microwave Conference, EuMC 1996 - Prague
Duration: 1996 Sep 61996 Sep 13

Other

Other1996 26th European Microwave Conference, EuMC 1996
CityPrague
Period96/9/696/9/13

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ASJC Scopus subject areas

  • Computer Networks and Communications
  • Hardware and Architecture
  • Electrical and Electronic Engineering

Cite this

Nishikawa, K., Kamogawa, K., Tokumitsu, T., Aikawa, M., Hirano, M., & Sugitani, S. (1996). Highly-integrated three-dimensional MMIC 20-GHz single chip receiver. In 1996 26th European Microwave Conference, EuMC 1996 (Vol. 1, pp. 199-203). [4138607] IEEE Computer Society. https://doi.org/10.1109/EUMA.1996.337552