Highly-integrated three-dimensional MMIC 20-GHz single chip receiver

Kenjiro Nishikawa, Kenji Kamogawa, Tsuneo Tokumitsu, Masayoshi Aikawa, Makoto Hirano, Suehiro Sugitani

    Research output: Contribution to conferencePaperpeer-review

    8 Citations (Scopus)


    A highly-integrated, three-dimensional 20-GHz band single chip receiver employing four thin polyimide films on a GaAs wafer is presented. The fabricated receiver implements three RF variable-gain amplifiers, an image rejectlon mixer, two LO amplifiers, and a voltage controlled oscillatorin an areaof only 1.78 mm × 1.78 mm. The performances of the demonstrated receiver are a 17dB gain and an integration level about three times as high as those of conventional receiver MMICs. The design methodologies used to achieve compact RF circuits on a single chip are also described.

    Original languageEnglish
    Number of pages5
    Publication statusPublished - 1996 Jan 1
    Event1996 26th European Microwave Conference, EuMC 1996 - Prague, Czech Republic
    Duration: 1996 Sep 61996 Sep 13


    Conference1996 26th European Microwave Conference, EuMC 1996
    Country/TerritoryCzech Republic

    ASJC Scopus subject areas

    • Computer Networks and Communications
    • Hardware and Architecture
    • Electrical and Electronic Engineering


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