Highly- Intergrated 3-D MMIC Technology Being Applied to Novel Masterslice GaAs-and Si-MMIC's

Tsuneo Tokumitsu, Makoto Hirano, Kimiyoshi Yamasaki, Chikara Yamaguchi, Kenjiro Nishikawa, Masayoshi Aikawa

    Research output: Contribution to journalArticle

    Original languageEnglish
    JournalIEEE Journal of Solid-State Circuits
    Volume32
    Publication statusPublished - 1997 Apr 1

    Cite this

    Tokumitsu, T., Hirano, M., Yamasaki, K., Yamaguchi, C., Nishikawa, K., & Aikawa, M. (1997). Highly- Intergrated 3-D MMIC Technology Being Applied to Novel Masterslice GaAs-and Si-MMIC's. IEEE Journal of Solid-State Circuits, 32.

    Highly- Intergrated 3-D MMIC Technology Being Applied to Novel Masterslice GaAs-and Si-MMIC's. / Tokumitsu, Tsuneo; Hirano, Makoto; Yamasaki, Kimiyoshi; Yamaguchi, Chikara; Nishikawa, Kenjiro; Aikawa, Masayoshi.

    In: IEEE Journal of Solid-State Circuits, Vol. 32, 01.04.1997.

    Research output: Contribution to journalArticle

    Tokumitsu, T, Hirano, M, Yamasaki, K, Yamaguchi, C, Nishikawa, K & Aikawa, M 1997, 'Highly- Intergrated 3-D MMIC Technology Being Applied to Novel Masterslice GaAs-and Si-MMIC's', IEEE Journal of Solid-State Circuits, vol. 32.
    Tokumitsu T, Hirano M, Yamasaki K, Yamaguchi C, Nishikawa K, Aikawa M. Highly- Intergrated 3-D MMIC Technology Being Applied to Novel Masterslice GaAs-and Si-MMIC's. IEEE Journal of Solid-State Circuits. 1997 Apr 1;32.
    Tokumitsu, Tsuneo ; Hirano, Makoto ; Yamasaki, Kimiyoshi ; Yamaguchi, Chikara ; Nishikawa, Kenjiro ; Aikawa, Masayoshi. / Highly- Intergrated 3-D MMIC Technology Being Applied to Novel Masterslice GaAs-and Si-MMIC's. In: IEEE Journal of Solid-State Circuits. 1997 ; Vol. 32.
    @article{69b397f6f10f4d2e988ae62f10f21410,
    title = "Highly- Intergrated 3-D MMIC Technology Being Applied to Novel Masterslice GaAs-and Si-MMIC's",
    author = "Tsuneo Tokumitsu and Makoto Hirano and Kimiyoshi Yamasaki and Chikara Yamaguchi and Kenjiro Nishikawa and Masayoshi Aikawa",
    year = "1997",
    month = "4",
    day = "1",
    language = "English",
    volume = "32",
    journal = "IEEE Journal of Solid-State Circuits",
    issn = "0018-9200",
    publisher = "Institute of Electrical and Electronics Engineers Inc.",

    }

    TY - JOUR

    T1 - Highly- Intergrated 3-D MMIC Technology Being Applied to Novel Masterslice GaAs-and Si-MMIC's

    AU - Tokumitsu, Tsuneo

    AU - Hirano, Makoto

    AU - Yamasaki, Kimiyoshi

    AU - Yamaguchi, Chikara

    AU - Nishikawa, Kenjiro

    AU - Aikawa, Masayoshi

    PY - 1997/4/1

    Y1 - 1997/4/1

    M3 - Article

    VL - 32

    JO - IEEE Journal of Solid-State Circuits

    JF - IEEE Journal of Solid-State Circuits

    SN - 0018-9200

    ER -