Highly- Intergrated 3-D MMIC Technology Being Applied to Novel Masterslice GaAs-and Si-MMIC's

Tsuneo Tokumitsu, Makoto Hirano, Kimiyoshi Yamasaki, Chikara Yamaguchi, Kenjiro Nishikawa, Masayoshi Aikawa

    Research output: Contribution to journalArticle

    Original languageEnglish
    JournalIEEE Journal of Solid-State Circuits
    Volume32
    Publication statusPublished - 1997 Apr 1

    Cite this

    Tokumitsu, T., Hirano, M., Yamasaki, K., Yamaguchi, C., Nishikawa, K., & Aikawa, M. (1997). Highly- Intergrated 3-D MMIC Technology Being Applied to Novel Masterslice GaAs-and Si-MMIC's. IEEE Journal of Solid-State Circuits, 32.