Abstract
We report on the ablation and hole drilling in stainless steel SUS304 and Si by femtosecond pulses (wavelength 800 nm; pulse duration > 80 fs) at the room and low (5 Torr) air pressure ambient. It was found that the quality of surface processing is improved at low pressure avoiding debris formation. The improvement is due to suppression of the conical emission, resulting from the air optical breakdown at a pre-surface area of sample. Debris-free processing of the movable Si-MEMS components is demonstrated. Techniques for the precise measurement of focal spot size and pulse duration are discussed.
| Original language | English |
|---|---|
| Pages (from-to) | 1555-1559 |
| Number of pages | 5 |
| Journal | Applied Physics A: Materials Science and Processing |
| Volume | 79 |
| Issue number | 4-6 |
| DOIs | |
| Publication status | Published - 2004 |
ASJC Scopus subject areas
- Chemistry(all)
- Materials Science(all)
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Juodkazis, S., Okuno, H., Kujime, N., Matsuo, S., & Misawa, H. (2004). Hole drilling in stainless steel and silicon by femtosecond pulses at low pressure. Applied Physics A: Materials Science and Processing, 79(4-6), 1555-1559. https://doi.org/10.1007/s00339-004-2846-0