Hole drilling in stainless steel and silicon by femtosecond pulses at low pressure

S. Juodkazis, H. Okuno, N. Kujime, Shigeki Matsuo, H. Misawa

Research output: Contribution to journalArticle

31 Citations (Scopus)

Abstract

We report on the ablation and hole drilling in stainless steel SUS304 and Si by femtosecond pulses (wavelength 800 nm; pulse duration > 80 fs) at the room and low (5 Torr) air pressure ambient. It was found that the quality of surface processing is improved at low pressure avoiding debris formation. The improvement is due to suppression of the conical emission, resulting from the air optical breakdown at a pre-surface area of sample. Debris-free processing of the movable Si-MEMS components is demonstrated. Techniques for the precise measurement of focal spot size and pulse duration are discussed.

Original languageEnglish
Pages (from-to)1555-1559
Number of pages5
JournalApplied Physics A: Materials Science and Processing
Volume79
Issue number4-6
Publication statusPublished - 2004 Sep
Externally publishedYes

Fingerprint

Stainless Steel
Silicon
Ultrashort pulses
drilling
debris
Debris
stainless steels
Drilling
pulse duration
Stainless steel
low pressure
air
silicon
Processing
Ablation
Air
pulses
ablation
microelectromechanical systems
MEMS

ASJC Scopus subject areas

  • Materials Science(all)
  • Physics and Astronomy (miscellaneous)

Cite this

Hole drilling in stainless steel and silicon by femtosecond pulses at low pressure. / Juodkazis, S.; Okuno, H.; Kujime, N.; Matsuo, Shigeki; Misawa, H.

In: Applied Physics A: Materials Science and Processing, Vol. 79, No. 4-6, 09.2004, p. 1555-1559.

Research output: Contribution to journalArticle

Juodkazis, S. ; Okuno, H. ; Kujime, N. ; Matsuo, Shigeki ; Misawa, H. / Hole drilling in stainless steel and silicon by femtosecond pulses at low pressure. In: Applied Physics A: Materials Science and Processing. 2004 ; Vol. 79, No. 4-6. pp. 1555-1559.
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