Hole drilling in stainless steel and silicon by femtosecond pulses at low pressure

S. Juodkazis; H. Okuno; N. Kujime; S. Matsuo; H. Misawa

doi:10.1007/s00339-004-2846-0

Hole drilling in stainless steel and silicon by femtosecond pulses at low pressure

S. Juodkazis, H. Okuno, N. Kujime, S. Matsuo, H. Misawa

Research output: Contribution to journal › Article › peer-review

31 Citations (Scopus)

Abstract

We report on the ablation and hole drilling in stainless steel SUS304 and Si by femtosecond pulses (wavelength 800 nm; pulse duration > 80 fs) at the room and low (5 Torr) air pressure ambient. It was found that the quality of surface processing is improved at low pressure avoiding debris formation. The improvement is due to suppression of the conical emission, resulting from the air optical breakdown at a pre-surface area of sample. Debris-free processing of the movable Si-MEMS components is demonstrated. Techniques for the precise measurement of focal spot size and pulse duration are discussed.

Original language	English
Pages (from-to)	1555-1559
Number of pages	5
Journal	Applied Physics A: Materials Science and Processing
Volume	79
Issue number	4-6
DOIs	https://doi.org/10.1007/s00339-004-2846-0
Publication status	Published - 2004
Externally published	Yes

ASJC Scopus subject areas

Chemistry(all)
Materials Science(all)

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AU - Juodkazis, S.

AU - Okuno, H.

AU - Kujime, N.

AU - Matsuo, S.

AU - Misawa, H.

PY - 2004

Y1 - 2004

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AB - We report on the ablation and hole drilling in stainless steel SUS304 and Si by femtosecond pulses (wavelength 800 nm; pulse duration > 80 fs) at the room and low (5 Torr) air pressure ambient. It was found that the quality of surface processing is improved at low pressure avoiding debris formation. The improvement is due to suppression of the conical emission, resulting from the air optical breakdown at a pre-surface area of sample. Debris-free processing of the movable Si-MEMS components is demonstrated. Techniques for the precise measurement of focal spot size and pulse duration are discussed.

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Hole drilling in stainless steel and silicon by femtosecond pulses at low pressure

Abstract

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