Improved heat treatment for wafer direct bonding between semiconductors and magnetic garnets

Hideki Yokoi, Tetsuya Mizumoto, Koichi Maru, Yoshiyuki Naito

Research output: Contribution to journalArticle

10 Citations (Scopus)

Abstract

The optical propagation loss of rib waveguides fabricated on magnetic garnet films increased upon annealing in H2 ambient during wafer direct bonding. The heat treatment in wafer direct bonding between InP and Gd3Ga5O12 was investigated with the aim of circumventing the loss increase. The bonding was achieved by heat treatment in H2 ambient at temperatures of ≦ 330°C or in N2 ambient.

Original languageEnglish
Pages (from-to)2784-2787
Number of pages4
JournalJapanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers
Volume36
Issue number5 A
Publication statusPublished - 1997 May
Externally publishedYes

Fingerprint

Garnets
garnets
heat treatment
Heat treatment
wafers
Semiconductor materials
Light propagation
Waveguides
Annealing
waveguides
annealing
propagation
Temperature
temperature

Keywords

  • Absorption loss
  • Garnets
  • Wafer direct bonding
  • X-ray photoelectron spectroscopy rib waveguide

ASJC Scopus subject areas

  • Physics and Astronomy (miscellaneous)
  • Engineering(all)

Cite this

Improved heat treatment for wafer direct bonding between semiconductors and magnetic garnets. / Yokoi, Hideki; Mizumoto, Tetsuya; Maru, Koichi; Naito, Yoshiyuki.

In: Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers, Vol. 36, No. 5 A, 05.1997, p. 2784-2787.

Research output: Contribution to journalArticle

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