Improvement on thermal fatigue properties of Sn-1.2Ag-0.5Cu flip chip interconnects by nickel addition

Shinichi Terashima, Yoshiharu Kariya, Masatomo Tanaka

Research output: Contribution to journalArticle

30 Citations (Scopus)
Original languageEnglish
Pages (from-to)673-680
JournalMETARIALS TRANSACTIONS
Volume45
Publication statusPublished - 2004 Mar 1

Cite this

Improvement on thermal fatigue properties of Sn-1.2Ag-0.5Cu flip chip interconnects by nickel addition. / Terashima, Shinichi; Kariya, Yoshiharu; Tanaka, Masatomo.

In: METARIALS TRANSACTIONS, Vol. 45, 01.03.2004, p. 673-680.

Research output: Contribution to journalArticle

@article{85ac72123f6543d39af919e6e61a9929,
title = "Improvement on thermal fatigue properties of Sn-1.2Ag-0.5Cu flip chip interconnects by nickel addition",
author = "Shinichi Terashima and Yoshiharu Kariya and Masatomo Tanaka",
year = "2004",
month = "3",
day = "1",
language = "English",
volume = "45",
pages = "673--680",
journal = "METARIALS TRANSACTIONS",

}

TY - JOUR

T1 - Improvement on thermal fatigue properties of Sn-1.2Ag-0.5Cu flip chip interconnects by nickel addition

AU - Terashima, Shinichi

AU - Kariya, Yoshiharu

AU - Tanaka, Masatomo

PY - 2004/3/1

Y1 - 2004/3/1

M3 - Article

VL - 45

SP - 673

EP - 680

JO - METARIALS TRANSACTIONS

JF - METARIALS TRANSACTIONS

ER -