Improvement on thermal fatigue properties of Sn-1.2Ag-0.5Cu flip chip interconnects by nickel addition

Shinichi Terashima, Yoshiharu Kariya, Masatomo Tanaka

Research output: Contribution to journalArticle

30 Citations (Scopus)
Original languageEnglish
Pages (from-to)673-680
JournalMETARIALS TRANSACTIONS
Volume45
Publication statusPublished - 2004 Mar 1

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