| Original language | English |
|---|---|
| Pages (from-to) | 673-680 |
| Journal | METARIALS TRANSACTIONS |
| Volume | 45 |
| Publication status | Published - 2004 Mar 1 |
Cite this
Terashima, S., Kariya, Y., & Tanaka, M. (2004). Improvement on thermal fatigue properties of Sn-1.2Ag-0.5Cu flip chip interconnects by nickel addition. METARIALS TRANSACTIONS, 45, 673-680.
Improvement on thermal fatigue properties of Sn-1.2Ag-0.5Cu flip chip interconnects by nickel addition. / Terashima, Shinichi; Kariya, Yoshiharu; Tanaka, Masatomo.
In: METARIALS TRANSACTIONS, Vol. 45, 01.03.2004, p. 673-680.Research output: Contribution to journal › Article
Terashima, S, Kariya, Y & Tanaka, M 2004, 'Improvement on thermal fatigue properties of Sn-1.2Ag-0.5Cu flip chip interconnects by nickel addition', METARIALS TRANSACTIONS, vol. 45, pp. 673-680.
Terashima S, Kariya Y, Tanaka M. Improvement on thermal fatigue properties of Sn-1.2Ag-0.5Cu flip chip interconnects by nickel addition. METARIALS TRANSACTIONS. 2004 Mar 1;45:673-680.
@article{85ac72123f6543d39af919e6e61a9929,
title = "Improvement on thermal fatigue properties of Sn-1.2Ag-0.5Cu flip chip interconnects by nickel addition",
author = "Shinichi Terashima and Yoshiharu Kariya and Masatomo Tanaka",
year = "2004",
month = "3",
day = "1",
language = "English",
volume = "45",
pages = "673--680",
journal = "METARIALS TRANSACTIONS",
}
TY - JOUR
T1 - Improvement on thermal fatigue properties of Sn-1.2Ag-0.5Cu flip chip interconnects by nickel addition
AU - Terashima, Shinichi
AU - Kariya, Yoshiharu
AU - Tanaka, Masatomo
PY - 2004/3/1
Y1 - 2004/3/1
M3 - Article
VL - 45
SP - 673
EP - 680
JO - METARIALS TRANSACTIONS
JF - METARIALS TRANSACTIONS
ER -