Improvement on thermal fatigue properties of Sn-1.2Ag-0.5Cu flip chip interconnects by nickel addition

Shinichi Terashima, Yoshiharu Kariya, Masatomo Tanaka

Research output: Contribution to journal › Article

Cite this

@article{85ac72123f6543d39af919e6e61a9929,

title = "Improvement on thermal fatigue properties of Sn-1.2Ag-0.5Cu flip chip interconnects by nickel addition",

author = "Shinichi Terashima and Yoshiharu Kariya and Masatomo Tanaka",

year = "2004",

month = mar,

day = "1",

language = "English",

volume = "45",

pages = "673--680",

journal = "METARIALS TRANSACTIONS",

}