Original language | English |
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Pages (from-to) | 673-680 |
Journal | METARIALS TRANSACTIONS |
Volume | 45 |
Publication status | Published - 2004 Mar 1 |
Improvement on thermal fatigue properties of Sn-1.2Ag-0.5Cu flip chip interconnects by nickel addition
Shinichi Terashima, Yoshiharu Kariya, Masatomo Tanaka
Research output: Contribution to journal › Article › peer-review
30
Citations
(Scopus)