Abstract
The effects of waveform symmetry on the low-cycle fatigue life of the Sn-3.0Ag-0.5Cu alloy have been investigated, using micro solder joint specimens with approximately the same volume of solder as is used in actual products. Focusing on crack initiation life, fatigue tests on Sn-Ag-Cu micro solder joints using asymmetrical triangular waveforms revealed no significant reduction in fatigue life. A slight reduction in fatigue life at low strain ranges caused by an increase in the fatigue ductility exponent, which is the result of a weakening microstructure due to loads applied at high temperature for long testing time, was observed. This was due to the fact that grain boundary damage, which has been reported in large-size specimens subjected to asymmetrical triangular waveforms, does not occur in Sn-Ag-Cu micro size solder joints with only a small number of crystal grain boundaries.
| Original language | English |
|---|---|
| Pages (from-to) | 238-245 |
| Number of pages | 8 |
| Journal | Journal of Electronic Materials |
| Volume | 39 |
| Issue number | 2 |
| DOIs | |
| Publication status | Published - 2010 Feb 1 |
Keywords
- Asymmetrical waveform
- Lead-free solder
- Low-cycle fatigue
- Microstructure
- Miniature testing
- Sn-Ag-Cu
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Electrical and Electronic Engineering
- Materials Chemistry