Influence of cyclic strain-hardening exponent on fatigue ductility exponent for a Sn-Ag-Cu micro-solder joint

Yoshihiko Kanda, Yoshiharu Kariya, Yuji Oto

Research output: Contribution to journalArticle

20 Citations (Scopus)

Abstract

The fatigue ductility exponent in the Coffin-Manson law for a Sn-Ag-Cu micro-solder joint was investigated in terms of the cyclic strain-hardening property and the inelastic strain energy in fracture for isothermal fatigue. The fatigue ductility exponent was found to increase with temperature and holding time under strain at high temperature. This exponent is closely related to the cyclic strain-hardening exponent, which displays the opposite behavior in that it decreases with increasing temperature and with coarsening of intermetallic compound particles while holding under strain at high temperature. This result differs from the creep damage mechanism (grain boundary fracture), which is a primary reason for the significant reduction in fatigue life for all strain ranges for large-size specimens.

Original languageEnglish
Pages (from-to)580-587
Number of pages8
JournalJournal of Electronic Materials
Volume41
Issue number3
DOIs
Publication statusPublished - 2012 Mar

Fingerprint

strain hardening
solders
ductility
Strain hardening
Soldering alloys
Ductility
Fatigue of materials
exponents
Coffin-Manson law
Temperature
fatigue life
Coarsening
Strain energy
Intermetallics
intermetallics
Creep
Grain boundaries
grain boundaries
damage
temperature

Keywords

  • Fatigue ductility exponent
  • Lead-free solder
  • Low-cycle fatigue
  • Microstructure
  • Miniature testing
  • Sn-Ag-Cu

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Materials Chemistry

Cite this

Influence of cyclic strain-hardening exponent on fatigue ductility exponent for a Sn-Ag-Cu micro-solder joint. / Kanda, Yoshihiko; Kariya, Yoshiharu; Oto, Yuji.

In: Journal of Electronic Materials, Vol. 41, No. 3, 03.2012, p. 580-587.

Research output: Contribution to journalArticle

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