Influence of Inelastic Constitutive Equation on Fatigue Life Prediction of Sn-Ag-Cu Micro Solder Joint

Y. K, a a, K. Zama, Y. Kariya

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)1-6
JournalProc. of ICEP2010
Publication statusPublished - 2010 May 1

Cite this

Influence of Inelastic Constitutive Equation on Fatigue Life Prediction of Sn-Ag-Cu Micro Solder Joint. / K, Y.; a, a; Zama, K.; Kariya, Y.

In: Proc. of ICEP2010, 01.05.2010, p. 1-6.

Research output: Contribution to journalArticle

@article{8688a550857248cab05d82e1b040dca3,
title = "Influence of Inelastic Constitutive Equation on Fatigue Life Prediction of Sn-Ag-Cu Micro Solder Joint",
author = "Y. K and a a and K. Zama and Y. Kariya",
year = "2010",
month = "5",
day = "1",
language = "English",
pages = "1--6",
journal = "Proc. of ICEP2010",

}

TY - JOUR

T1 - Influence of Inelastic Constitutive Equation on Fatigue Life Prediction of Sn-Ag-Cu Micro Solder Joint

AU - K, Y.

AU - a, a

AU - Zama, K.

AU - Kariya, Y.

PY - 2010/5/1

Y1 - 2010/5/1

M3 - Article

SP - 1

EP - 6

JO - Proc. of ICEP2010

JF - Proc. of ICEP2010

ER -