Inscribing diffraction grating inside silicon substrate using a subnanosecond laser in one photon absorption wavelength

Kozo Sugimoto, Shigeki Matsuo, Yoshiki Naoi

Research output: Contribution to journalArticlepeer-review

1 Citation (Scopus)

Abstract

Using focused subnanosecond laser pulses at 1.064μm wavelength, modification of silicon into opaque state was induced. While silicon exhibits one-photon absorption at this wavelength, the modification was induced inside 300μm-thick silicon substrate without damaging top or bottom surfaces. The depth range of the focus position was investigated where inside of the substrate can be modified without damaging the surfaces. Using this technique, diffraction gratings were inscribed inside silicon substrate. Diffraction from the gratings were observed, and the diffraction angle well agreed with the theoretical value. These results demonstrate that this technique could be used for fabricating infrared optical elements in silicon.

Original languageEnglish
Article number21451
JournalScientific Reports
Volume10
Issue number1
DOIs
Publication statusPublished - 2020 Dec

ASJC Scopus subject areas

  • General

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