Instantaneous phase-stepping photoelasticity and hybrid stress analysis for a curving crack under thermal load

S. Yoneyama, Kenichi Sakaue

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Stress fields around an oscillating crack tip in a thin plate are analyzed using a hybrid method of photoelasticity and finite element analysis. Instantaneous phase-stepping photoelasticity using a CCD camera equipped with a pixelated micro-retarder array is used for measuring the stress fields around a propagating crack tip in a quenched thin glass plate. The distributions of the principal direction as well as the principal stress difference around a growing crack are obtained. Then, the values of the principal direction and the principal stress difference are used for determining the boundary condition for a local finite element model. Using the boundary condition that is determined from the measurement results inversely, the stress distributions around a crack are evaluated. It is shown that the stresses around the crack tip can be evaluated using the proposed hybrid method. Results show that the proposed hybrid method is effective for the study of crack growth behavior in the quenched glass plate.

Original languageEnglish
Title of host publicationConference Proceedings of the Society for Experimental Mechanics Series
Pages391-402
Number of pages12
Volume3
DOIs
Publication statusPublished - 2013
Event2012 Annual Conference on Experimental and Applied Mechanics - Costa Mesa, CA
Duration: 2012 Jun 112012 Jun 14

Other

Other2012 Annual Conference on Experimental and Applied Mechanics
CityCosta Mesa, CA
Period12/6/1112/6/14

Fingerprint

Photoelasticity
Thermal load
Stress analysis
Cracks
Crack tips
Boundary conditions
Glass
CCD cameras
Stress concentration
Crack propagation
Finite element method

ASJC Scopus subject areas

  • Engineering(all)
  • Computational Mechanics
  • Mechanical Engineering

Cite this

Yoneyama, S., & Sakaue, K. (2013). Instantaneous phase-stepping photoelasticity and hybrid stress analysis for a curving crack under thermal load. In Conference Proceedings of the Society for Experimental Mechanics Series (Vol. 3, pp. 391-402) https://doi.org/10.1007/978-1-4614-4235-6_54

Instantaneous phase-stepping photoelasticity and hybrid stress analysis for a curving crack under thermal load. / Yoneyama, S.; Sakaue, Kenichi.

Conference Proceedings of the Society for Experimental Mechanics Series. Vol. 3 2013. p. 391-402.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Yoneyama, S & Sakaue, K 2013, Instantaneous phase-stepping photoelasticity and hybrid stress analysis for a curving crack under thermal load. in Conference Proceedings of the Society for Experimental Mechanics Series. vol. 3, pp. 391-402, 2012 Annual Conference on Experimental and Applied Mechanics, Costa Mesa, CA, 12/6/11. https://doi.org/10.1007/978-1-4614-4235-6_54
Yoneyama S, Sakaue K. Instantaneous phase-stepping photoelasticity and hybrid stress analysis for a curving crack under thermal load. In Conference Proceedings of the Society for Experimental Mechanics Series. Vol. 3. 2013. p. 391-402 https://doi.org/10.1007/978-1-4614-4235-6_54
Yoneyama, S. ; Sakaue, Kenichi. / Instantaneous phase-stepping photoelasticity and hybrid stress analysis for a curving crack under thermal load. Conference Proceedings of the Society for Experimental Mechanics Series. Vol. 3 2013. pp. 391-402
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