Integrated optical isolator employing nonreciprocal phase shift by wafer direct bonding

H. Yokoi, T. Mizumoto

Research output: Contribution to journalConference articlepeer-review

1 Citation (Scopus)

Abstract

A novel configuration of an integrated optical isolator employing a nonreciprocal phase shift is proposed. The isolator is equipped with a cladding layer of magnetic garnets by means of wafer direct bonding technique. This device has a semiconductor guiding layer, so high compatibility in integrating with other semiconductor optical devices is expected.

Original languageEnglish
Pages (from-to)469-473
Number of pages5
JournalMaterials Research Society Symposium - Proceedings
Volume517
DOIs
Publication statusPublished - 1998
EventProceedings of the 1998 MRS Spring Symposium - San Francisco, CA, USA
Duration: 1998 Apr 131998 Apr 15

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

Fingerprint

Dive into the research topics of 'Integrated optical isolator employing nonreciprocal phase shift by wafer direct bonding'. Together they form a unique fingerprint.

Cite this