Integrating laser diode and optical isolator by photosensitive adhesive bonding

H. Yokoi, N. Ichishima, I. Myouenzono

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

An integrating technique between a laser diode and an optical isolator is proposed. The optical isolator has a magneto-optic waveguide with a Si guiding layer. The laser diode is integrated with the optical isolator by use of photosensitive adhesive bonding. A coupling efficiency between an active layer of the laser diode and a passive waveguide is discussed. Photosensitive adhesive bonding between a garnet crystal and a SiO2 substrate is demonstrated.

Original languageEnglish
Title of host publicationSemiconductor Wafer Bonding 12
Subtitle of host publicationScience, Technology, and Applications
Pages393-398
Number of pages6
Edition7
DOIs
Publication statusPublished - 2012 Dec 1
Event12th International Symposium on Semiconductor Wafer Bonding: Science, Technology, and Applications - ECS Fall 2012 Meeting - Honolulu, HI, United States
Duration: 2012 Oct 72012 Oct 12

Publication series

NameECS Transactions
Number7
Volume50
ISSN (Print)1938-5862
ISSN (Electronic)1938-6737

Conference

Conference12th International Symposium on Semiconductor Wafer Bonding: Science, Technology, and Applications - ECS Fall 2012 Meeting
CountryUnited States
CityHonolulu, HI
Period12/10/712/10/12

ASJC Scopus subject areas

  • Engineering(all)

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  • Cite this

    Yokoi, H., Ichishima, N., & Myouenzono, I. (2012). Integrating laser diode and optical isolator by photosensitive adhesive bonding. In Semiconductor Wafer Bonding 12: Science, Technology, and Applications (7 ed., pp. 393-398). (ECS Transactions; Vol. 50, No. 7). https://doi.org/10.1149/05007.0393ecst