Integration of terraced laser diode and optical isolator by wafer direct bonding

Hideki Yokoi, Tetsuya Mizumoto

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Wafer direct bonding is a technique for integration of dissimilar materials without any adhesives. This technique is applied to the bonding between III-V compound semiconductors and garnet crystals, to integrate a laser diode and an optical isolator. The isolator is contacted with the terraced laser diode by wafer bonding and heat treatment in hydrogen ambience.

Original languageEnglish
Title of host publicationConference on Lasers and Electro-Optics Europe - Technical Digest
Place of PublicationPiscataway, NJ, United States
PublisherIEEE
Pages36
Number of pages1
Publication statusPublished - 2000
Externally publishedYes
Event2000 Confernce on Lasers and Electro-Optics Europe (CLEO 2000) - Nice, France
Duration: 2000 Sep 102000 Sep 15

Other

Other2000 Confernce on Lasers and Electro-Optics Europe (CLEO 2000)
CityNice, France
Period00/9/1000/9/15

Fingerprint

Semiconductor lasers
Dissimilar materials
Wafer bonding
Garnets
Adhesives
Heat treatment
Hydrogen
Crystals
III-V semiconductors

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

Cite this

Yokoi, H., & Mizumoto, T. (2000). Integration of terraced laser diode and optical isolator by wafer direct bonding. In Conference on Lasers and Electro-Optics Europe - Technical Digest (pp. 36). Piscataway, NJ, United States: IEEE.

Integration of terraced laser diode and optical isolator by wafer direct bonding. / Yokoi, Hideki; Mizumoto, Tetsuya.

Conference on Lasers and Electro-Optics Europe - Technical Digest. Piscataway, NJ, United States : IEEE, 2000. p. 36.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Yokoi, H & Mizumoto, T 2000, Integration of terraced laser diode and optical isolator by wafer direct bonding. in Conference on Lasers and Electro-Optics Europe - Technical Digest. IEEE, Piscataway, NJ, United States, pp. 36, 2000 Confernce on Lasers and Electro-Optics Europe (CLEO 2000), Nice, France, 00/9/10.
Yokoi H, Mizumoto T. Integration of terraced laser diode and optical isolator by wafer direct bonding. In Conference on Lasers and Electro-Optics Europe - Technical Digest. Piscataway, NJ, United States: IEEE. 2000. p. 36
Yokoi, Hideki ; Mizumoto, Tetsuya. / Integration of terraced laser diode and optical isolator by wafer direct bonding. Conference on Lasers and Electro-Optics Europe - Technical Digest. Piscataway, NJ, United States : IEEE, 2000. pp. 36
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